AI to Create Tremendous Opportunities for Silicon Wafers and Effectively Drive the 300mm Wafer Carrier Boxes Market

Introduction

The AI semiconductor market will reach a value of USD 65 billion by 2025 (U.S. International Trade Commission). Players across industries are significantly investing in the development of products incorporated with AI. Silicon wafer is an essential element in building AI-based systems. Silicon wafers are turned into silicon chips, which operate like neurons to handle deep learning tasks in AI systems. Therefore, the rise of AI will be a powerful driving force in the semiconductor industry for the coming decade.

Market Dynamics

PP and PC – The Most Widely Used Materials in the Manufacturing of 300mm Wafer Carrier Boxes

Polypropylene (PP) material is widely used in 300 mm wafer carrier boxes due to its tough and flexible nature; PP wafer carrier boxes are resilient to all types of damage and contamination, which may otherwise be possible shipping and storage. Polycarbonate (PC) material, available in clear, red, blue, or green options, allows easy identification of the product from all angles. As Semiconductor manufacturers rely extensively on colored wafer carriers for product and process distinction; one-third to half of the semiconductor companies prefer colored carriers (RTP Company). PP and PC segments are expected to grow at a CAGR of 13.9% and 13.7%, respectively.

Segmental Analysis

FOUP Segment to Hold the Largest Market Share by Application

FOUP wafer carriers are designed to hold silicon wafers safely and securely in a controlled environment. They are used in semiconductor manufacturing process lines and allow the wafer to be transferred between machines for processing measurement. As of 2018, the FOUP segment’s share exceeded 60% of the total market. FOSB wafer carrier cassettes are used for the safe transportation of 300mm wafers as they preserve material purity and product integrity during the processing, storage, and transportation of wafers between facilities. The FOSB segment is expected to grow at a CAGR of 14.3% during the forecast period.

Regional Overview

The recent surge in silicon wafer manufacturing across North America is presenting tremendous opportunities for market growth in the region. According to the Semiconductor Industry Association, semiconductors is the U.S.’s fourth-largest export business, and the country holds a 45% global market share in the semiconductor industry and 13% in wafer production capacity.

In Europe, the demand for the 300mm wafer FOUP carrier boxes is rising in tandem with the growth in silicon wafer fab manufacturing. According to SEMI, Europe experienced 48% growth during 2014–2015 in the fab packaging market.

Many leading fabless manufacturers outsource fabrication to Asian countries so as to capitalize on inexpensive labor and the low cost of fabrication. TSMC and UMC are the largest producers of semiconductor wafers and subsequently, prominent consumers of related shipping and handling products.

Brazil holds the largest market share in the LAMEA region. Leading players, having recognized the potential of the market in Brazil, are making significant investments to cater to the future demand in the country. For instance, in 2019, Qualcomm announced plans to open a semiconductor factory in the state of Sao Paulo, Brazil.

Competitive Players

1. Chung King Enterprise Co. Ltd.
2. Entegris
3. E-SUN 
4. Gudeng Precision
5. 3S Korea. Co. Ltd.
6. Miraial Co. Ltd.
7. Pozzetta
8. Shin-Etsu Polymer Co. Ltd.

Recent Developments

• June 2023- CEA-Leti and Intel formed a collaborative research effort to advance the layer transfer technique of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers. This initiative aims to prolong Moore's Law beyond the year 2030.
• November 2023- Texas Instruments (TI) (Nasdaq: TXN) commenced construction on its new 300-mm semiconductor wafer fabrication unit (also known as "fab") in Lehi, Utah. Accompanied by Utah Governor Spencer Cox, state and municipal elected officials, and community leaders, TI President and CEO Haviv Ilan commemorated the initial stages of building the new fab, LFAB2. This facility will be linked to the company's current 300-mm wafer fab in Lehi.

Segmentation

1. By Type
   1. PP
   2. PC
   3. PBT
   4. PEEK
   5. PFA
   6. Others
2. By Applications
   1. 300mm Wafer FOUP
   2. 300mm Wafer FOSB