The ICs use photons for carrying data, unlike electronic ICs that utilize electrons for data transfer. As optical rays can transmit more data and enable quicker data transfer rates than copper-based communications, they are preferred to electrical semiconductor techniques. Due to the usage of optical technology, the system is discrete. These chips can also be added to fundamental electronic circuits, broadening their application possibilities. The high-speed data transfer made possible by these circuits is one of the key drivers driving the market for photonic integrated circuits. It makes them suitable for various aerospace, industrial, communications, utilities, and energy applications.
According to automotive, aerospace, and telecom companies collaborating to produce spectrometers for the LiDAR industry, there is a great need for small, affordable, and reliable Photonics Integrated Circuits. Miniaturization is, therefore, in high commercial demand. The allied device had a silicon dioxide layer and a thin lithium niobate (LN) coating, which resulted in a small, energy-efficient modulator that could operate at high speeds. The modulator's electro-optical modal volume was 0.58 m3, and its tuning efficiency was 1.98 GHz/V with a 17.5 GHz modulation bandwidth.
As integrated optical signal processors work with conventional electrical signal processors to create cutting-edge signal-processing hardware platforms, a significant improvement in processing bandwidth, latency, and power economy is desired. Similarly, according to Mitsubishi Electric Research Laboratories, the silicon photonics platform has been considering new building blocks to increase processor capabilities and offer helpful features in line with the increasing shrinking of devices. Additionally, it is preferred to make it possible for complex circuits to be ultra-densely integrated into processor chips.
Hybrid PICs provide many advantages for the telecoms and data center industries. The demand for a high data transfer rate, which conventional ICs cannot support, is the primary driver of the expanding use of hybrid PIC in the telecom and data center markets. The development of 5G and high-speed networks has been cited for additional acceleration. PICs are a well-known technology in the telecom sector thanks to the development and extensive use of transceivers and passive components. The introduction of 5G has increased the prominence of wireless and radio technology.
However, photonics and fiber optics have greatly aided the current base station generation's ability to receive and transmit signals. Other manufacturers are benefiting from high levels of innovation by using it to make low-cost hybrid PIC hardware to meet their demands. Additionally, as more cloud apps are developed, the amount of traffic data centers must manage is rapidly growing (DC).
Asia-Pacific is the most significant revenue contributor and is expected to grow at a CAGR of 25.2% during the forecast period. Asia-Pacific, especially China, has become an important market due to the expanding electronics and telecom industries and the quick movement of numerous semiconductor production bases to Southeast Asian nations. Over the past ten years, China's PICs technology has improved quickly. There have been released across the country more than nine large PIC projects. Various material technologies and platforms have been developed for applications focusing on broadband communication, including optical and wireless networks, optical interconnects, and coherent optical communication.
Europe is expected to grow at a CAGR of 22.6%, generating USD 18575.96 million during the forecast period. The European Commission, the EU's executive arm, has invested in photonic integrated circuit (IC) technology over several years. This entails cutting-edge expenditures on fundamental research, creating tools and software that demonstrate a concept, and, more recently, pilot line manufacture. Due to this, the regions today have a growing PIC ecosystem that has the potential to unleash the power of PIC technologies and help the locals on a variety of social and economic fronts. Several additional efforts have also been launched to enhance PIC development throughout Europe. For instance, InPulse is a pilot program that would provide access to the most recent production technology for PICs based on indium phosphide to businesses with brilliant ideas but no PIC manufacturing facilities.
The global photonic integrated circuit market size was valued at USD 15452.26 million in 2024 and is projected to reach from USD 18913.57 million in 2025 to USD 95285.06 million by 2033, growing at a CAGR of 22.4% during the forecast period (2025-2033).