Global WLCSP Electroless Platting Market Grows Steadily at a CAGR of 5.7%

Introduction

In manufacturing, electroless plating creates the conductive portion of printed circuit boards. It is a method for plating PCBs that do not require an external power supply. Placing the part in an aqueous solution, depositing nickel, and establishing a catalytic reduction of nickel ions to plate the part without electrical energy distribution are the steps involved in this procedure. Wafer-level chip scale package, or WLCSP, is the process of packaging an integrated circuit at the wafer level instead of placing individual units in packages after slicing wafers into smaller parts. In contrast to BGA, wafer-level CSP does not require bond wires or interposer connections. Die-to-PCB inductance is lowered as a result of wafer-level CSP, together with package size reduction and improved thermal conduction properties.

Market Dynamics

Impending Need for Circuit Miniaturization and Micro Electric Devices Drives the Global Market

The industry for medical devices is witnessing a rise in demand for nano-sized robotic surgery equipment, as well as sophistication and advancements in wearable and personalized healthcare technologies. Hence, the march toward smaller electronic devices has necessitated that designers abandon conventional plating in favor of WLCSP electroless plating. Due to the increase in demand for high-performance electronics, the semiconductor sector is seeing growth in miniaturized electronic devices. Moreover, the increased development of technologies like RFID, MEMS devices, and other power devices increases the demand for thin wafers. Thin wafers aid in reducing the thickness of containers, particularly for smartphones, mobile gadgets, and other compact electronic items. Emerging applications in semiconductor technology that make use of very thin and ultra-thin die generate a great demand for tiny electronic devices and contribute to the expansion of the worldwide WLCSP electroless plating market.

Increasing Demand for WLCSP Electroless Plating in the Aerospace and Healthcare Industry Creates Tremendous Opportunities

The semiconductor plating industry delivers sophisticated IC packages for chip designs of the next generation. Historically, the integrated circuit industry employed conventional chip scaling and revolutionary device topologies. In addition, multi-chip packages exist in every phone, data center, consumer electronics, and network, promoting system optimization and pushing the rise of advanced packaging. Therefore, modern WLCSP electroless plating is advantageous for numerous industry verticals, including the automotive, healthcare, aerospace and military, and industrial sectors, which are now using it.

Regional Analysis

Asia-Pacific is the most significant global WLCSP electroless platting market shareholder and is anticipated to grow at a CAGR of 6.3% during the forecast period. Due to the availability of high-end upgraded technologies, the rising demand for new electronics, and the expansion of manufacturing industries, it is the most attractive market for WLCSP electronic plating. Moreover, numerous non-profit organizations that promote packaging innovations contribute to the expansion. These businesses undertake different initiatives to construct power infrastructure using advanced technologies, which propels the regional growth of the WLCSP electroless plating market. In addition, due to the rising demand for high-voltage working devices, businesses across all industries recognize the significance of packaging technologies in ensuring efficient power management. Increasing demand for automated switching devices and power modules will stimulate market expansion.

Europe is estimated to exhibit a CAGR of 3.9% over the forecast period. Europe has significant potential for global WLCSP electroless plating industry participants. The market is principally driven by the growth of the European economy and the escalating penetration of Chinese goods in Western and Eastern Europe. Major businesses are acquiring minor semiconductor firms to bolster their market position and supply next-generation technology via their product range. Europe's WLCSP electroless plating technology suppliers are presented with several growth prospects due to the expansion of digital electronic devices, the acceptance of sophisticated electronic vehicles, and the development of advanced virtual systems. Furthermore, due to the development of the consumer electronics industry, the adoption of advanced technologies such as advanced driver assistance in automotive, and the demand for low-power consumption devices in the region, the advanced packaging market is expected to experience a rapid growth rate during the forecast period.

Key Highlights

• The global WLCSP electroless platting market was valued at USD 3,398.85 million in 2022. It is estimated to reach USD 5,596.93 million by 2031, growing at a CAGR of 5.7% during the forecast period (2023–2031).
• Based on type, the global WLCSP electroless platting market is bifurcated into nickel, copper, and composites.The nickel segment is the highest contributor to the market and is projected to grow at a CAGR of 4.7% over the forecast period.
• Based on the end-user, the global WLCSP electroless platting market is segmented into automotive, electronics, aerospace, machinery, and others. The electronics segment owns the highest market share and is estimated to exhibit a CAGR of 5.8% during the forecast period.
• Asia-Pacific is the most significant global WLCSP electroless platting market shareholder and is anticipated to grow at a CAGR of 6.3% during the forecast period.

Competitive Players

Competitive Players

The key players in the global WLCSP electroless platting market are Atotech Deutschland GmbH, ARC Technologies, Inc., MacDermid, Inc., KC Jones Plating Company, Okuno Chemical Industries Co., Ltd. COVENTYA International, C. Uyemura & Co., Ltd., Nihon Parkerizing Co., Ltd., ERIE PLATING COMPANY, and Bales Metal Surface Solutions (Bales).

Recent Developments

Market News

• In January 2023, Surface Technology Inc. revealed that One-Plate Electroless Nickel is now accessible on Amazon and other e-commerce websites owing to a partnership with electroplating kit supplier Caswell Plating.

• In August 2022, MKS Instruments, Inc., an international technology provider that allows advanced processes and boosts productivity, completed its previously announced purchase of Atotech Limited, a leading company in process chemicals, equipment, software, and surface finishing services for printed circuit boards and semiconductor IC packaging.

Segmentation

Global WLCSP Electroless Platting Market: Segmentation

By Type

• Nickel
• Copper
• Composites

By End-User

• Automotive
• Electronics
• Aerospace
• Machinery
• Others

By Regions

• North America
• Europe
• Asia-Pacific
• LAMEA