May 2026 Entegris and JSR Corporation (Inpria) entered into a non-exclusive cross-licensing agreement covering metal oxide resist (MOR) patents for extreme ultraviolet (EUV) lithography. The agreement also includes exploration of future collaboration on next-generation photoresist materials, strengthening the semiconductor materials ecosystem that supports advanced CMP processes.
May 2026 Entegris announced continued expansion of its CMP consumables portfolio, highlighting new solutions for molybdenum-based semiconductor nodes, including CMP slurries, polishing pads, post-CMP cleaning chemistries, and contamination control technologies to support advanced chip manufacturing.
April 2026 Entegris reported continued investments in its Materials Solutions segment, expanding its portfolio of CMP slurries, polishing pads, and post-CMP cleaning materials to address increasing demand driven by AI, advanced logic, and memory semiconductor manufacturing.
September 2025 Fujimi Incorporated expanded its portfolio of CMP slurry solutions for advanced semiconductor manufacturing by introducing new polishing materials optimized for next-generation logic and memory devices, supporting higher planarization performance and defect reduction.