July 2026 Fukuda Metal Foil & Powder presented research on the properties of copper and copper-alloy powders used in additive manufacturing and the characteristics of components fabricated from these materials, supporting the development of specialized powders for advanced industrial applications.
May 2026 Fukuda Metal Foil & Powder presented research on the sintering properties of water-atomized copper-zinc-aluminium alloy powders, advancing powder formulations for powder metallurgy and high-performance component manufacturing.
April 2026 Fukuda Metal Foil & Powder published research examining how silver addition affects copper-chromium alloys produced through laser powder-bed fusion, supporting the development of copper-based powders for additive manufacturing applications.
November 2025 Fukuda Metal Foil & Powder introduced its nanoThin ultra-thin copper-flake series at the 30th Filler Symposium. The product series targets conductive fillers, electronic materials, coatings and other applications requiring thin, high-performance copper particles.