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Home Technology Electronic Design Automation Software Market Size, Scope, Share to 2030
Electronic Design Automation (EDA) Software Market

Electronic Design Automation (EDA) Software Market Size, Share & Trends Analysis Report By Type (Computer-aided Engineering (CAE), IC Physical Design and Verification, Printed Circuit Board and Multi-chip Module (PCB and MCM), Semiconductor Intellectual Property (SIP), Services), By Application (Communication, Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Medical, Healthcare, Others), By Deployment (Cloud, On-premise), By End-use (Microprocessors & Controllers, Memory Management Unit (MMU), Others) and By Region(North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2022-2030

Report Code: SRTE607DR
Last Updated : August 31, 2022
Author : Straits Research
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Table Of Content

  1. Executive Summary
    1. Research Objectives
    2. Limitations & Assumptions
    3. Market Scope & Segmentation
    4. Currency & Pricing Considered
    1. Emerging Regions / Countries
    2. Emerging Companies
    3. Emerging Applications / End Use
    1. Drivers
    2. Market Warning Factors
    3. Latest Macro Economic Indicators
    4. Geopolitical Impact
    5. Technology Factors
    1. Porters Five Forces Analysis
    2. Value Chain Analysis
    1. North America
    2. Europe
    3. APAC
    4. Middle East and Africa
    5. LATAM
  2. ESG Trends
    1. Global Electronic Design Automation (EDA) Software Market Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    6. U.S.
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
        6. Services
          1. By Value
      2. By Application
        1. Introduction
          1. Application By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Aerospace & Defense
          1. By Value
        7. Medical
          1. By Value
        8. Healthcare
          1. By Value
        9. Others
          1. By Value
      3. By Deployment
        1. Introduction
          1. Deployment By Value
        2. Cloud
          1. By Value
        3. On-premise
          1. By Value
      4. By End-use
        1. Introduction
          1. End-use By Value
        2. Microprocessors & Controllers
          1. By Value
        3. Memory Management Unit (MMU)
          1. By Value
        4. Others
          1. By Value
    7. Canada
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    6. U.K.
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
        6. Services
          1. By Value
      2. By Application
        1. Introduction
          1. Application By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Aerospace & Defense
          1. By Value
        7. Medical
          1. By Value
        8. Healthcare
          1. By Value
        9. Others
          1. By Value
      3. By Deployment
        1. Introduction
          1. Deployment By Value
        2. Cloud
          1. By Value
        3. On-premise
          1. By Value
      4. By End-use
        1. Introduction
          1. End-use By Value
        2. Microprocessors & Controllers
          1. By Value
        3. Memory Management Unit (MMU)
          1. By Value
        4. Others
          1. By Value
    7. Germany
    8. France
    9. Spain
    10. Italy
    11. Russia
    12. Nordic
    13. Benelux
    14. Rest of Europe
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    6. China
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
        6. Services
          1. By Value
      2. By Application
        1. Introduction
          1. Application By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Aerospace & Defense
          1. By Value
        7. Medical
          1. By Value
        8. Healthcare
          1. By Value
        9. Others
          1. By Value
      3. By Deployment
        1. Introduction
          1. Deployment By Value
        2. Cloud
          1. By Value
        3. On-premise
          1. By Value
      4. By End-use
        1. Introduction
          1. End-use By Value
        2. Microprocessors & Controllers
          1. By Value
        3. Memory Management Unit (MMU)
          1. By Value
        4. Others
          1. By Value
    7. Korea
    8. Japan
    9. India
    10. Australia
    11. Taiwan
    12. South East Asia
    13. Rest of Asia-Pacific
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    6. UAE
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
        6. Services
          1. By Value
      2. By Application
        1. Introduction
          1. Application By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Aerospace & Defense
          1. By Value
        7. Medical
          1. By Value
        8. Healthcare
          1. By Value
        9. Others
          1. By Value
      3. By Deployment
        1. Introduction
          1. Deployment By Value
        2. Cloud
          1. By Value
        3. On-premise
          1. By Value
      4. By End-use
        1. Introduction
          1. End-use By Value
        2. Microprocessors & Controllers
          1. By Value
        3. Memory Management Unit (MMU)
          1. By Value
        4. Others
          1. By Value
    7. Turkey
    8. Saudi Arabia
    9. South Africa
    10. Egypt
    11. Nigeria
    12. Rest of MEA
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
      6. Services
        1. By Value
    3. By Application
      1. Introduction
        1. Application By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Aerospace & Defense
        1. By Value
      7. Medical
        1. By Value
      8. Healthcare
        1. By Value
      9. Others
        1. By Value
    4. By Deployment
      1. Introduction
        1. Deployment By Value
      2. Cloud
        1. By Value
      3. On-premise
        1. By Value
    5. By End-use
      1. Introduction
        1. End-use By Value
      2. Microprocessors & Controllers
        1. By Value
      3. Memory Management Unit (MMU)
        1. By Value
      4. Others
        1. By Value
    6. Brazil
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
        6. Services
          1. By Value
      2. By Application
        1. Introduction
          1. Application By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Aerospace & Defense
          1. By Value
        7. Medical
          1. By Value
        8. Healthcare
          1. By Value
        9. Others
          1. By Value
      3. By Deployment
        1. Introduction
          1. Deployment By Value
        2. Cloud
          1. By Value
        3. On-premise
          1. By Value
      4. By End-use
        1. Introduction
          1. End-use By Value
        2. Microprocessors & Controllers
          1. By Value
        3. Memory Management Unit (MMU)
          1. By Value
        4. Others
          1. By Value
    7. Mexico
    8. Argentina
    9. Chile
    10. Colombia
    11. Rest of LATAM
    1. Electronic Design Automation (EDA) Software Market Share By Players
    2. M&A Agreements & Collaboration Analysis
    1. ANSYS, Inc.
      1. Overview
      2. Business Information
      3. Revenue
      4. ASP
      5. SWOT Analysis
      6. Recent Developments
    2. Altair
    3. Altium LLC
    4. Aldec, Inc.
    5. Autodesk
    6. Cadence Design Systems, Inc.
    7. Keysight Technologies
    8. Mentor (a Siemens Business)
    9. Silvaco Inc. 
    10. Synopsys
    1. Research Data
      1. Secondary Data
        1. Major secondary sources
        2. Key data from secondary sources
      2. Primary Data
        1. Key data from primary sources
        2. Breakdown of primaries
      3. Secondary And Primary Research
        1. Key industry insights
    2. Market Size Estimation
      1. Bottom-Up Approach
      2. Top-Down Approach
      3. Market Projection
    3. Research Assumptions
      1. Assumptions
    4. Limitations
    5. Risk Assessment
    1. Discussion Guide
    2. Customization Options
    3. Related Reports
  3. Disclaimer

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Market Overview The global electronic design automation (EDA) tools market size was valued at USD 11.69 billion in 2021. It is projected to reach USD 26.37 billion by 2030, growing at a CAGR of 9.46% during the forecast period (2022-2030). 
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