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Electronic Design Automation (EDA) Tools Market

Electronic Design Automation (EDA) Tools Market Size, Share & Trends Analysis Report By Type (Computer-aided Engineering (CAE), IC Physical Design and Verification, Printed Circuit Board and Multi-chip Module (PCB and MCM), Semiconductor Intellectual Property (SIP)), By Applications (Communication, Consumer Electronics, Automotive, Industrial, Others) and By Region(North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2022-2030

Report Code: SRAP2841DR
Last Updated : August 14, 2024
Author : Straits Research
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Table Of Content

  1. Executive Summary
    1. Research Objectives
    2. Limitations & Assumptions
    3. Market Scope & Segmentation
    4. Currency & Pricing Considered
    1. Emerging Regions / Countries
    2. Emerging Companies
    3. Emerging Applications / End Use
    1. Drivers
    2. Market Warning Factors
    3. Latest Macro Economic Indicators
    4. Geopolitical Impact
    5. Technology Factors
    1. Porters Five Forces Analysis
    2. Value Chain Analysis
    1. North America
    2. Europe
    3. APAC
    4. Middle East and Africa
    5. LATAM
  2. ESG Trends
    1. Global Electronic Design Automation (EDA) Tools Market Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    4. U.S.
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
      2. By Applications
        1. Introduction
          1. Applications By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Others
          1. By Value
    5. Canada
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    4. U.K.
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
      2. By Applications
        1. Introduction
          1. Applications By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Others
          1. By Value
    5. Germany
    6. France
    7. Spain
    8. Italy
    9. Russia
    10. Nordic
    11. Benelux
    12. Rest of Europe
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    4. China
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
      2. By Applications
        1. Introduction
          1. Applications By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Others
          1. By Value
    5. Korea
    6. Japan
    7. India
    8. Australia
    9. Taiwan
    10. South East Asia
    11. Rest of Asia-Pacific
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    4. UAE
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
      2. By Applications
        1. Introduction
          1. Applications By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Others
          1. By Value
    5. Turkey
    6. Saudi Arabia
    7. South Africa
    8. Egypt
    9. Nigeria
    10. Rest of MEA
    1. Introduction
    2. By Type
      1. Introduction
        1. Type By Value
      2. Computer-aided Engineering (CAE)
        1. By Value
      3. IC Physical Design and Verification
        1. By Value
      4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
        1. By Value
      5. Semiconductor Intellectual Property (SIP)
        1. By Value
    3. By Applications
      1. Introduction
        1. Applications By Value
      2. Communication
        1. By Value
      3. Consumer Electronics
        1. By Value
      4. Automotive
        1. By Value
      5. Industrial
        1. By Value
      6. Others
        1. By Value
    4. Brazil
      1. By Type
        1. Introduction
          1. Type By Value
        2. Computer-aided Engineering (CAE)
          1. By Value
        3. IC Physical Design and Verification
          1. By Value
        4. Printed Circuit Board and Multi-chip Module (PCB and MCM)
          1. By Value
        5. Semiconductor Intellectual Property (SIP)
          1. By Value
      2. By Applications
        1. Introduction
          1. Applications By Value
        2. Communication
          1. By Value
        3. Consumer Electronics
          1. By Value
        4. Automotive
          1. By Value
        5. Industrial
          1. By Value
        6. Others
          1. By Value
    5. Mexico
    6. Argentina
    7. Chile
    8. Colombia
    9. Rest of LATAM
    1. Electronic Design Automation (EDA) Tools Market Share By Players
    2. M&A Agreements & Collaboration Analysis
    1. Altium Limited
      1. Overview
      2. Business Information
      3. Revenue
      4. ASP
      5. SWOT Analysis
      6. Recent Developments
    2. ANSYS Inc
    3. Cadence Design Systems Inc
    4. Keysight Technologies Inc
    5. Agnisys Inc
    6. Aldec Inc
    7. Lauterbach GmbH
    8. Mentor Graphic Corporation (Siemens)
    9. Synopsys Inc
    10. Xilinx Inc
    11. Zuken Ltd
    1. Research Data
      1. Secondary Data
        1. Major secondary sources
        2. Key data from secondary sources
      2. Primary Data
        1. Key data from primary sources
        2. Breakdown of primaries
      3. Secondary And Primary Research
        1. Key industry insights
    2. Market Size Estimation
      1. Bottom-Up Approach
      2. Top-Down Approach
      3. Market Projection
    3. Research Assumptions
      1. Assumptions
    4. Limitations
    5. Risk Assessment
    1. Discussion Guide
    2. Customization Options
    3. Related Reports
  3. Disclaimer

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