June 2026 ASML expanded its extreme ultraviolet lithography technology roadmap by advancing next-generation EUV systems, including High-NA EUV platforms, to support advanced semiconductor manufacturing processes. The company focused on improving chip fabrication capabilities for artificial intelligence, high-performance computing, and advanced logic applications.
May 2026 Intel expanded its advanced semiconductor manufacturing initiatives by increasing adoption of next-generation lithography technologies, including EUV systems, to support advanced process nodes and improve chip manufacturing capabilities.
April 2026 TSMC expanded its semiconductor manufacturing capabilities by advancing integration of EUV lithography technologies across advanced process nodes. The company focused on improving production efficiency and supporting demand for AI, HPC, and high-performance semiconductor applications.
January 2026 ASML strengthened collaborations with semiconductor manufacturers and research partners to accelerate development and deployment of High-NA EUV lithography systems. The initiatives focused on enabling smaller transistor designs and next-generation chip architectures.