MWS Machine for SiC Wafer Market Size, Share & Trends Analysis Report By Wire Type (Slurry Wire Type, Diamond Wire Type), By Wire Diameter (100 - 150 microns, 150 - 200 microns, 200 - 250 microns, Above 250 microns), By Cutting Speed (Below 100 m/s, 100 - 200 m/s, 200 - 300 m/s, Above 300 m/s), By Cutting Method (Fixed Abrasive Cutting, Loose Abrasive Cutting) and By Region(North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2024-2032

MWS Machine for SiC Wafer Market Size and Trends

The global MWS machine for SiC wafer market size was valued at USD 125.72 million in 2024. It is projected to reach USD 324.11 million by 2032, growing at a CAGR of 12.6% during the forecast period (2024–2032). The global MWS machine for the SiC wafer market is primarily driven by the surging demand for SiC wafers and their components in the electric vehicle industry. Moreover, technological advancements in MWS machine technology by the market players are estimated to create opportunities for global market expansion.

MWS (Multi-Wire Saw) machines are advanced cutting tools used for slicing silicon carbide (SiC) wafers, a crucial material in high-power and high-frequency electronic devices. These machines employ numerous thin wires coated with abrasive slurry to precisely cut through the hard and brittle SiC material, ensuring minimal waste and high-quality surface finish. The process involves drawing the wire through a slurry bath containing abrasive particles, which grind away the material as the wire moves.

MWS machines are favored for their ability to produce thin, uniform wafers with reduced kerf loss (material lost during cutting) compared to traditional sawing methods. Their high precision and efficiency make them essential in the production of SiC wafers, which are increasingly in demand for applications in power electronics, electric vehicles, and renewable energy systems due to their superior thermal conductivity, high electric field strength, and resistance to high temperatures.

Market Highlights

• Diamond type dominates the wire type segment
• 200-300 m/s dominates the cutting speed segment
• Fixed abrasive cutting dominates the cutting method segment
• Asia-Pacific is the highest shareholder in the global market

Global MWS Machine for SiC Wafer Market Growth Factors

Rising Demand in the Electric Vehicle (EV) Industry

The growing adoption of electric vehicles (EVs) worldwide is a significant driver for the MWS machine for the SiC wafer market. SiC wafers are increasingly being used in power electronics for EVs due to their higher efficiency, reduced power loss, and ability to operate at higher temperatures compared to traditional silicon-based semiconductors.

According to the International Energy Agency (IEA), global EV sales surpassed 10 million units in 2022, a 55% increase from the previous year, and are expected to grow further. This surge in EV production necessitates the use of SiC wafers, which in turn drives the demand for MWS machines capable of efficiently slicing these hard materials. Companies like Tesla and BYD are increasingly incorporating SiC-based components in their EVs, further fueling the need for advanced MWS machines in the production of SiC wafers.

Global MWS Machine for SiC Wafer Market Restraining Factors

High Cost of SiC Wafers and MWS Machines

Despite the growing demand, the high cost of SiC wafers and the associated MWS machines remains a significant restraint in the market. SiC wafers are more expensive to produce than traditional silicon wafers due to the complex manufacturing processes involved, including the use of specialized MWS machines that are both costly to purchase and maintain.

According to industry reports, SiC wafers can cost up to five times more than silicon wafers, which limits their adoption to high-performance applications where cost considerations are secondary to efficiency and performance gains. Moreover, the high initial investment required for MWS machines, ranging from USD 2 million to USD 5 million per unit, poses a barrier to entry for smaller companies. This high-cost structure could hinder the widespread adoption of SiC wafers in various industries, thereby constraining the growth of the MWS machine market.

Global MWS Machine for SiC Wafer Market Opportunities

Advancements in MWS Machine Technology

Technological advancements in MWS machines present a significant opportunity for market growth. Innovations aimed at improving cutting precision, reducing kerf loss, and increasing the overall efficiency of SiC wafer production are expected to drive demand for newer MWS machines.

• For instance, the development of diamond wire sawing technology has significantly enhanced the cutting speed and precision of SiC wafers, reducing material wastage and lowering production costs.

Furthermore, companies investing in research and development to improve MWS machine capabilities are likely to capture a larger market share as these advanced machines become essential in the production of high-quality SiC wafers. Moreover, the integration of automation and IoT technologies in MWS machines is expected to streamline production processes, reduce labor costs, and increase output, making these machines more attractive to manufacturers.

MWS Machine for SiC Wafer Market Regional Analysis

Asia Pacific: Dominant Region with 12.8% Growth Rate (CAGR)

Asia-Pacific held the most significant market share and is projected to expand at a CAGR of 12.8% during the forecast period. The Asia-Pacific region is poised to be a key growth driver in the global MWS machine for the SiC wafer market. This region is home to some of the largest semiconductor manufacturing hubs and is rapidly adopting Silicon Carbide (SiC) technology across various industries, including automotive, renewable energy, and consumer electronics. The demand for SiC wafers and, consequently, MWS machines is expected to surge in this region due to the rising adoption of electric vehicles (EVs) and the expansion of renewable energy capacity.

China’s MWS machine for SiC wafer market is set to dominate due to its massive semiconductor industry and aggressive push toward electric vehicles. As the world's largest EV market, China accounted for over 6 million EV sales in 2023, according to the China Association of Automobile Manufacturers (CAAM). This rapid growth in EV adoption has spurred demand for SiC wafers, which are essential for efficient power management in EVs.

Moreover, China's semiconductor industry, backed by significant government investment, is increasingly incorporating SiC technology. Companies like SICC (Shandong Iraeta Grinding Ball Co., Ltd) are expanding their SiC wafer production capacities, driving the need for advanced MWS machines to support this growth.

India MWS machines for SiC wafers market, although at an earlier stage than China, is emerging as a significant market, driven by its growing focus on renewable energy and electric mobility. The Indian government's ambitious target of achieving 175 GW of renewable energy capacity by 2022 has created a substantial demand for power electronics based on SiC wafers, particularly in solar and wind energy systems.

Additionally, the push towards electric vehicles under the Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME) scheme is expected to boost the demand for SiC technology in the automotive sector. Furthermore, Indian companies are beginning to explore SiC wafer production, presenting opportunities for MWS machine manufacturers to establish a foothold in this burgeoning market. Thus, the factors above are estimated to augment the Asia-Pacific MWS machine for SiC wafer market growth.

Europe is a significant market for MWS machines for SiC wafers, driven by the region's focus on advancing semiconductor technology and the increasing adoption of electric vehicles. The European Union's strong emphasis on green energy and carbon reduction goals further propels the demand for SiC-based technologies, thereby boosting the market for MWS machines. Germany and France, as key players in Europe's technological landscape, are at the forefront of this growth.

Europe: Rapid Growth in Germany and France

Germany’s MWS Machine for SiC wafer market, known for its advanced automotive industry, is a major. The country is a leader in electric vehicle production, with companies like Volkswagen and BMW heavily investing in SiC technology to enhance the efficiency and performance of EV powertrains. According to the German Association of the Automotive Industry (VDA), the country produced over 1.5 million electric vehicles in 2023, a 20% increase from the previous year. This surge in EV production is driving the demand for SiC wafers, thereby fueling the market for MWS machines in Germany.

France MWS Machine for SiC wafer market is emerging as a significant player, particularly in the renewable energy and automotive sectors. The French government's commitment to reducing carbon emissions, as outlined in the National Low-Carbon Strategy, is encouraging the adoption of SiC-based power electronics in various applications. Companies like STMicroelectronics, headquartered in France, are expanding their SiC wafer production capacities to meet the growing demand. The expansion of SiC wafer production in France is expected to boost the market for MWS machines, supporting the country's transition to more efficient semiconductor technologies. Consequently, all these factors are anticipated to foster the expansion of the European MWS machine for the SiC wafer market.

MWS Machine for the SiC Wafer Market Segmentation Analysis

By Wire Type

The diamond-type segment owns the market and is projected to grow at a CAGR of 12.8% during the forecast period. Multi-wire cutting with a diamond wire saw has gradually become the main processing method for hard-and-brittle materials due to its small kerf loss and high machining accuracy. Diamond wires are known for their exceptional hardness, making them a preferred choice in applications that require high cutting precision and minimal material loss. Industries with stringent specifications for wafer thickness, such as those in semiconductor manufacturing, find diamond-type MWS machines to be indispensable.

Moreover, these machines contribute significantly to achieving precise cuts on SiC wafers, ensuring that the final products meet the exacting standards of the semiconductor industry. The use of diamond wires enhances the overall efficiency and quality of the cutting process, making diamond-type machines integral in scenarios where precision is paramount.

By Wire Diameter

The 150 - 200 microns held the largest market share and is projected to expand at a CAGR of 12.7% over the forecast period. These MWS machines, which fall into the 150–200-micron range, manage to remove material with a balance between precision and force. This sub-segment is chosen when there's a need to compromise between cutting speed and accuracy. It is used in situations where obtaining a certain degree of accuracy is essential but also where a respectable rate of material removal is necessary.

By Cutting Speed

The 200-300 m/s segment dominated the market, growing at a CAGR of 13.3% throughout the forecast period. In scenarios where a higher cutting speed is essential, the 200 - 300 m/s sub-segment of MWS machines provides efficient solutions. These machines are chosen for applications where accelerated production rates are crucial, but quality must not be compromised. This segment caters to industries that prioritize efficiency in material processing without sacrificing the integrity of the final product.

By Cutting Method

The fixed abrasive cutting segment held the greatest market share and is anticipated to develop at a CAGR of 12.8% during the forecast period. Fixed Abrasive Cutting in MWS machines utilizes a stable abrasive tool for cutting SiC wafers. This method ensures a consistent and controlled cutting process, making it suitable for applications requiring uniformity in wafer dimensions. The stable abrasive tool remains constant during the cutting operation, providing precision and reliability. This approach is often favored in industries that prioritize the production of SiC wafers with standardized thickness and surface characteristics.

Recent Developments

• August 2024- SweGaN, a Swedish company specializing in epitaxy, commenced the delivery of wafers containing gallium nitride on silicon carbide (GaN on SiC) for high-power RF applications in the next 5G Advanced networks.

Analyst’s Perspective

As per our research analyst, the future of the MWS machine for SiC wafer industry is promising, driven by the expansion of EV and renewable energy markets. In addition, efforts to reduce SiC wafer costs through innovations in cutting efficiency and automation will be crucial. Moreover, new applications in aerospace, defense, and consumer electronics will emerge, further boosting demand. Moreover, the geographical expansion, particularly in Asia-Pacific and Europe, will contribute to growth.