July 2026 ASML raised its 2026 sales outlook and announced plans to increase EUV lithography system production capacity by 30% in both 2027 and 2028, driven by sustained AI-related semiconductor demand.
May 2026 ASM International introduced its PE2 Osprey plasma-enhanced atomic layer deposition (PEALD) system, expanding its advanced deposition equipment portfolio for next-generation semiconductor manufacturing.
November 2025 BE Semiconductor Industries (Besi) introduced next-generation hybrid bonding and advanced packaging equipment designed to support AI and high-performance computing semiconductor manufacturing across Europe.
September 2025 ASM International expanded its semiconductor equipment portfolio with new atomic layer deposition (ALD) solutions for advanced logic and memory chip production, strengthening its European manufacturing technology offerings.