January 2026 Vishay Intertechnology introduced new 100 V Gen 2 TMBS® (Trench MOS Barrier Schottky) rectifier modules in the SOT-227 package. The new devices provide reduced forward voltage drop and lower conduction losses, targeting industrial power conversion applications requiring higher efficiency and reliability.
September 2025 Infineon Technologies AG and ROHM Co., Ltd. signed a Memorandum of Understanding (MoU) to collaborate on silicon carbide (SiC) power semiconductor packages. The partnership enables second-source availability for selected SiC products used in electric vehicle onboard chargers, renewable energy systems, energy storage, and AI data centers, strengthening the advanced rectifier and power semiconductor ecosystem.
September 2025 Vishay Intertechnology expanded its semiconductor rectifier portfolio with the launch of Gen 7 FRED Pt® Hyperfast Rectifiers in the SlimSMA HV package. The new 1200 V rectifiers are designed for industrial and automotive applications, offering reduced switching losses, lower reverse recovery charge, and improved efficiency.