01 Increasing Adoption of Ev's and Renewable Energy Systems One significant trend in the global market is the increasing adoption of TIMs in electric vehicles (EVs) and renewable energy systems. As EVs gain popularity, the demand for effective thermal management solutions is surging, driven by the need to maintain battery efficiency and longevity. Thermal interface materials are essential for managing the heat generated by battery packs and power electronics in EVs.According to the International Energy Agency (IEA), global electric car sales reached over 10 million units in 2023, reflecting a significant rise from previous years. This surge in EV adoption is a major contributor to the growth of the global market. Additionally, the push towards renewable energy, particularly in solar and wind power, is creating new avenues for TIMs, as these systems require efficient thermal management to optimize performance. This market trend highlights the growing importance of TIMs in supporting the transition to sustainable energy solutions.
June 2026 Noctua and Carbice entered a long-term strategic partnership to commercialize carbon-nanotube thermal interface pads for the DIY PC market. Noctua became Carbice’s exclusive retail distributor and introduced the NT-CP1 AM5/4 thermal pad for AMD Ryzen processors, while both companies agreed to collaborate on future product development.
May 2026 AMD selected the Carbice Ice Pad carbon-nanotube thermal interface material for bundling with its relaunched Ryzen 7 5800X3D processor, expanding Carbice’s technology from specialized aerospace and data-center applications into mainstream consumer computing.
May 2026 Henkel launched Bergquist TGF 2030APS, a silicone-free thermal gap filler, and Loctite TLB 9270APS, a polyurethane-based thermally conductive adhesive. The materials were developed to improve heat dissipation, automated dispensing and structural bonding in electric-vehicle battery modules.
March 2026 Eaton completed its USD 9.5 billion acquisition of Boyd Thermal, integrating Boyd’s liquid-cooling components, thermal systems and engineering capabilities into Eaton’s data-center and aerospace portfolio. The transaction expanded Eaton’s capabilities from electrical power infrastructure to chip-level thermal management.