About Us Services Careers FAQ Contact Us 0
Home Semiconductor & Electronics Global Wi-Fi Chipset Market Size, Top Trends and Forecast to 2031
Wi-Fi Chipset Market

Wi-Fi Chipset Market Size, Share & Trends Analysis Report By IEEE Standards (IEEE 802.11 ac Wave Series, IEEE 802.11 n (SB and DB), IEEE 802.11 a Series, IEEE 802.11 b/g), By Band (Dual band, Tri band, Single Band), By MIMO Configuration (MU-MIMO, SU-MIMO), By Fabrication Technology (Fin FET, FD-SOI, CMOS Bulk, Others), By Application (Smartphone, Access Point Equipment, PCs, Tablets, Others) and By Region(North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2023-2031

Report Code: SRSE1001DR
Author : Straits Research
Buy Now
File Formats

Table Of Content

  1. Executive Summary
    1. Research Objectives
    2. Limitations & Assumptions
    3. Market Scope & Segmentation
    4. Currency & Pricing Considered
    1. Emerging Regions / Countries
    2. Emerging Companies
    3. Emerging Applications / End Use
    1. Drivers
    2. Market Warning Factors
    3. Latest Macro Economic Indicators
    4. Geopolitical Impact
    5. Technology Factors
    1. Porters Five Forces Analysis
    2. Value Chain Analysis
    1. North America
    2. Europe
    3. APAC
    4. Middle East and Africa
    5. LATAM
  2. ESG Trends
    1. Global Wi-Fi Chipset Market Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    1. Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    7. U.S.
      1. By IEEE Standards
        1. Introduction
          1. IEEE Standards By Value
        2. IEEE 802.11 ac Wave Series
          1. By Value
        3. IEEE 802.11 n (SB and DB)
          1. By Value
        4. IEEE 802.11 a Series
          1. By Value
        5. IEEE 802.11 b/g
          1. By Value
      2. By Band
        1. Introduction
          1. Band By Value
        2. Dual band
          1. By Value
        3. Tri band
          1. By Value
        4. Single Band
          1. By Value
      3. By MIMO Configuration
        1. Introduction
          1. MIMO Configuration By Value
        2. MU-MIMO
          1. By Value
        3. SU-MIMO
          1. By Value
      4. By Fabrication Technology
        1. Introduction
          1. Fabrication Technology By Value
        2. Fin FET
          1. By Value
        3. FD-SOI
          1. By Value
        4. CMOS Bulk
          1. By Value
        5. Others
          1. By Value
      5. By Application
        1. Introduction
          1. Application By Value
        2. Smartphone
          1. By Value
        3. Access Point Equipment
          1. By Value
        4. PCs
          1. By Value
        5. Tablets
          1. By Value
        6. Others
          1. By Value
    8. Canada
    1. Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    7. U.K.
      1. By IEEE Standards
        1. Introduction
          1. IEEE Standards By Value
        2. IEEE 802.11 ac Wave Series
          1. By Value
        3. IEEE 802.11 n (SB and DB)
          1. By Value
        4. IEEE 802.11 a Series
          1. By Value
        5. IEEE 802.11 b/g
          1. By Value
      2. By Band
        1. Introduction
          1. Band By Value
        2. Dual band
          1. By Value
        3. Tri band
          1. By Value
        4. Single Band
          1. By Value
      3. By MIMO Configuration
        1. Introduction
          1. MIMO Configuration By Value
        2. MU-MIMO
          1. By Value
        3. SU-MIMO
          1. By Value
      4. By Fabrication Technology
        1. Introduction
          1. Fabrication Technology By Value
        2. Fin FET
          1. By Value
        3. FD-SOI
          1. By Value
        4. CMOS Bulk
          1. By Value
        5. Others
          1. By Value
      5. By Application
        1. Introduction
          1. Application By Value
        2. Smartphone
          1. By Value
        3. Access Point Equipment
          1. By Value
        4. PCs
          1. By Value
        5. Tablets
          1. By Value
        6. Others
          1. By Value
    8. Germany
    9. France
    10. Spain
    11. Italy
    12. Russia
    13. Nordic
    14. Benelux
    15. Rest of Europe
    1. Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    7. China
      1. By IEEE Standards
        1. Introduction
          1. IEEE Standards By Value
        2. IEEE 802.11 ac Wave Series
          1. By Value
        3. IEEE 802.11 n (SB and DB)
          1. By Value
        4. IEEE 802.11 a Series
          1. By Value
        5. IEEE 802.11 b/g
          1. By Value
      2. By Band
        1. Introduction
          1. Band By Value
        2. Dual band
          1. By Value
        3. Tri band
          1. By Value
        4. Single Band
          1. By Value
      3. By MIMO Configuration
        1. Introduction
          1. MIMO Configuration By Value
        2. MU-MIMO
          1. By Value
        3. SU-MIMO
          1. By Value
      4. By Fabrication Technology
        1. Introduction
          1. Fabrication Technology By Value
        2. Fin FET
          1. By Value
        3. FD-SOI
          1. By Value
        4. CMOS Bulk
          1. By Value
        5. Others
          1. By Value
      5. By Application
        1. Introduction
          1. Application By Value
        2. Smartphone
          1. By Value
        3. Access Point Equipment
          1. By Value
        4. PCs
          1. By Value
        5. Tablets
          1. By Value
        6. Others
          1. By Value
    8. Korea
    9. Japan
    10. India
    11. Australia
    12. Taiwan
    13. South East Asia
    14. Rest of Asia-Pacific
    1. Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    7. UAE
      1. By IEEE Standards
        1. Introduction
          1. IEEE Standards By Value
        2. IEEE 802.11 ac Wave Series
          1. By Value
        3. IEEE 802.11 n (SB and DB)
          1. By Value
        4. IEEE 802.11 a Series
          1. By Value
        5. IEEE 802.11 b/g
          1. By Value
      2. By Band
        1. Introduction
          1. Band By Value
        2. Dual band
          1. By Value
        3. Tri band
          1. By Value
        4. Single Band
          1. By Value
      3. By MIMO Configuration
        1. Introduction
          1. MIMO Configuration By Value
        2. MU-MIMO
          1. By Value
        3. SU-MIMO
          1. By Value
      4. By Fabrication Technology
        1. Introduction
          1. Fabrication Technology By Value
        2. Fin FET
          1. By Value
        3. FD-SOI
          1. By Value
        4. CMOS Bulk
          1. By Value
        5. Others
          1. By Value
      5. By Application
        1. Introduction
          1. Application By Value
        2. Smartphone
          1. By Value
        3. Access Point Equipment
          1. By Value
        4. PCs
          1. By Value
        5. Tablets
          1. By Value
        6. Others
          1. By Value
    8. Turkey
    9. Saudi Arabia
    10. South Africa
    11. Egypt
    12. Nigeria
    13. Rest of MEA
    1. Introduction
    2. By IEEE Standards
      1. Introduction
        1. IEEE Standards By Value
      2. IEEE 802.11 ac Wave Series
        1. By Value
      3. IEEE 802.11 n (SB and DB)
        1. By Value
      4. IEEE 802.11 a Series
        1. By Value
      5. IEEE 802.11 b/g
        1. By Value
    3. By Band
      1. Introduction
        1. Band By Value
      2. Dual band
        1. By Value
      3. Tri band
        1. By Value
      4. Single Band
        1. By Value
    4. By MIMO Configuration
      1. Introduction
        1. MIMO Configuration By Value
      2. MU-MIMO
        1. By Value
      3. SU-MIMO
        1. By Value
    5. By Fabrication Technology
      1. Introduction
        1. Fabrication Technology By Value
      2. Fin FET
        1. By Value
      3. FD-SOI
        1. By Value
      4. CMOS Bulk
        1. By Value
      5. Others
        1. By Value
    6. By Application
      1. Introduction
        1. Application By Value
      2. Smartphone
        1. By Value
      3. Access Point Equipment
        1. By Value
      4. PCs
        1. By Value
      5. Tablets
        1. By Value
      6. Others
        1. By Value
    7. Brazil
      1. By IEEE Standards
        1. Introduction
          1. IEEE Standards By Value
        2. IEEE 802.11 ac Wave Series
          1. By Value
        3. IEEE 802.11 n (SB and DB)
          1. By Value
        4. IEEE 802.11 a Series
          1. By Value
        5. IEEE 802.11 b/g
          1. By Value
      2. By Band
        1. Introduction
          1. Band By Value
        2. Dual band
          1. By Value
        3. Tri band
          1. By Value
        4. Single Band
          1. By Value
      3. By MIMO Configuration
        1. Introduction
          1. MIMO Configuration By Value
        2. MU-MIMO
          1. By Value
        3. SU-MIMO
          1. By Value
      4. By Fabrication Technology
        1. Introduction
          1. Fabrication Technology By Value
        2. Fin FET
          1. By Value
        3. FD-SOI
          1. By Value
        4. CMOS Bulk
          1. By Value
        5. Others
          1. By Value
      5. By Application
        1. Introduction
          1. Application By Value
        2. Smartphone
          1. By Value
        3. Access Point Equipment
          1. By Value
        4. PCs
          1. By Value
        5. Tablets
          1. By Value
        6. Others
          1. By Value
    8. Mexico
    9. Argentina
    10. Chile
    11. Colombia
    12. Rest of LATAM
    1. Wi-Fi Chipset Market Share By Players
    2. M&A Agreements & Collaboration Analysis
    1. Qualcomm Incorporated
      1. Overview
      2. Business Information
      3. Revenue
      4. ASP
      5. SWOT Analysis
      6. Recent Developments
    2. Broadcom
    3. Intel Corporation
    4. Media Tek
    5. SAMSUNG
    6. STMicroelectronics
    7. Cypress (Infineon Technologies)
    8. On Semiconductor
    9. Peraso Technologies
    10. Dialog Semiconductor
    11. Others
    1. Research Data
      1. Secondary Data
        1. Major secondary sources
        2. Key data from secondary sources
      2. Primary Data
        1. Key data from primary sources
        2. Breakdown of primaries
      3. Secondary And Primary Research
        1. Key industry insights
    2. Market Size Estimation
      1. Bottom-Up Approach
      2. Top-Down Approach
      3. Market Projection
    3. Research Assumptions
      1. Assumptions
    4. Limitations
    5. Risk Assessment
    1. Discussion Guide
    2. Customization Options
    3. Related Reports
  3. Disclaimer

Related Reports

Global Report
5G Chipset Market Size The global 5G chipset market size was valued at USD 33.75 billion in 2024 and is expected to grow from USD 45.56 billion in 2025 to reach USD 502.66 billion by 2033, growing at a CAGR of 35% during the forecast period (2025-20
Buy Now

Purchase Benefits

  • Eligible for a free updated report next year
  • Completely customizable scope
  • 30% discount on your next purchase
  • Dedicated account manager
  • Query resolution within 24 hours
  • Permission to print the report

We are featured on :

www.straitsresearch.com
© Copyright 2025. All rights Reserved.