Wi-Fi Chipset Market: Information by IEEE Standards, Band, MIMO Configuration (MU-MIMO, SU-MIMO), Fabrication Technology (FinFET, FD-SOI), Application, and Region — Forecast till 2029

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Table Of Content

TABLE OF CONTENTS

1              Introduction

1.1          Market Definition

1.2          Market Scope

2              Research Methodology

2.1          Primary Research

2.2          Research Methodology

2.3          Assumptions and Exclusions

2.4          Secondary Data Sources

3              Market Overview

3.1          Report Segmentation and Scope

3.2          Value Chain Analysis: Wi-Fi Chipset Market

3.3          Key Market Trends

3.3.1      Drivers

3.3.2      Restraints

3.3.3      Opportunities

3.4          Porter’s Five Forces Analysis

3.4.1      Bargaining Power of Suppliers

3.4.2      Bargaining Power of Buyers

3.4.3      Threat of Substitution

3.4.4      Threat of New Entrants

3.4.5      Competitive Rivalry

3.5          Market Share Analysis

3.6          Impact of COVID-19 on Wi-Fi Chipset Market

4              IEEE Standards Overview

4.1          Introduction

4.1.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.2          IEEE 802.11 ac Wave 2

4.2.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.3          IEEE 802.11 ac Wave 1

4.3.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.4          IEEE 802.11 n (SB and DB)

4.4.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.5          IEEE 802.11 ax

4.5.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.6          IEEE 802.11 ay

4.6.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.7          IEEE 802.11 ad

4.7.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

4.8          IEEE 802.11 b/g

4.8.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

5              Band Overview

5.1          Introduction

5.1.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

5.2          Dual band

5.2.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

5.3          Tri band

5.3.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

5.4          Single band

5.4.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

6              MIMO ConfigurationOverview

6.1          Introduction

6.1.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

6.2          SU-MIMO

6.2.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

6.3          MU-MIMO

6.3.1      1X1

6.3.1.1   Market Size and Forecast, 2017–2029 (U.S.D Million)

6.3.2      2X2

6.3.2.1   Market Size and Forecast, 2017–2029 (U.S.D Million)

6.3.3      3X3

6.3.3.1   Market Size and Forecast, 2017–2029 (U.S.D Million)

6.3.4      4X4

6.3.4.1   Market Size and Forecast, 2017–2029 (U.S.D Million)

6.3.5      8X8

6.3.5.1   Market Size and Forecast, 2017–2029 (U.S.D Million)

7              Fabrication TechnologyOverview

7.1          Introduction

7.1.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

7.2          Fin FET

7.2.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

7.3          FD-SOI

7.3.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

7.4          CMOS Bulk

7.4.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

7.5          Others

7.5.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

8              Application Overview

8.1          Introduction

8.1.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

8.2          Smartphone

8.2.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

8.3          Access Point Equipment

8.3.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

8.4          PCs

8.4.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

8.5          Tablets

8.5.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

8.6          Others

8.6.1      Market Size and Forecast, 2018–2029 (U.S.D Million)

9              Regional Analysis

9.1          Introduction

9.1.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

9.2          North America

9.2.1 Market Size and Forecast, 2017–2029 (U.S.D Million)

9.2.2        The U.S.

9.2.2.1     By IEEE Standards

9.2.2.2     By Band

9.2.2.3     ByMIMO Configuration

9.2.2.4     ByFabrication Technology

9.2.2.5     By Application

9.2.3        Canada

9.2.3.1     By IEEE Standards

9.2.3.2     By Band

9.2.3.3     ByMIMO Configuration

9.2.3.4     By Fabrication Technology

9.2.3.5     By Application

9.2.4        Mexico

9.2.4.1     By IEEE Standards

9.2.4.2     By Band

9.2.4.3     ByMIMO Configuration

9.2.4.4     By Fabrication Technology

9.2.4.5     By Application

9.3          Europe

9.3.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

9.3.2      Germany

9.3.2.1     By IEEE Standards

9.3.2.2     By Band

9.3.2.3     ByMIMO Configuration

9.3.2.4     By Fabrication Technology

9.3.2.5     By Application

9.3.3      France

9.3.3.1     By IEEE Standards

9.3.3.2     By Band

9.3.3.3     ByMIMO Configuration

9.3.3.4     By Fabrication Technology

9.3.3.5     By Application

9.3.4      The U.K.

9.3.4.1     By IEEE Standards

9.3.4.2     By Band

9.3.4.3     ByMIMO Configuration

9.3.4.4     By Fabrication Technology

9.3.4.5     By Application

9.3.5      Italy

9.3.5.1     By IEEE Standards

9.3.5.2     By Band

9.3.5.3     ByMIMO Configuration

9.3.5.4     By Fabrication Technology

9.3.5.5     By Application

9.3.6      Spain

9.3.6.1     By IEEE Standards

9.3.6.2     By Band

9.3.6.3     ByMIMO Configuration

9.3.6.4     By Fabrication Technology

9.3.6.5     By Application

9.3.7      Rest of Europe

9.3.7.1     By IEEE Standards

9.3.7.2     By Band

9.3.7.3     ByMIMO Configuration

9.3.7.4     By Fabrication Technology

9.3.7.5     By Application

9.4          Asia-Pacific

9.4.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

9.4.2      Japan

9.4.2.1     By IEEE Standards

9.4.2.2     By Band

9.4.2.3     ByMIMO Configuration

9.4.2.4     By Fabrication Technology

9.4.2.5     By Application

9.4.3      China

9.4.3.1     By IEEE Standards

9.4.3.2     By Band

9.4.3.3     ByMIMO Configuration

9.4.3.4     By Fabrication Technology

9.4.3.5     By Application

9.4.4      India

9.4.4.1     By IEEE Standards

9.4.4.2     By Band

9.4.4.3     ByMIMO Configuration

9.4.4.4     By Fabrication Technology

9.4.4.5     By Application

9.4.5      South Korea

9.4.5.1     By IEEE Standards

9.4.5.2     By Band

9.4.5.3     ByMIMO Configuration

9.4.5.4     By Fabrication Technology

9.4.5.5     By Application

9.4.6      Taiwan

9.4.6.1     By IEEE Standards

9.4.6.2     By Band

9.4.6.3     ByMIMO Configuration

9.4.6.4     By Fabrication Technology

9.4.6.5     By Application

9.4.7      ASEAN-6

9.4.7.1     By IEEE Standards

9.4.7.2     By Band

9.4.7.3     ByMIMO Configuration

9.4.7.4     By Fabrication Technology

9.4.7.5     By Application

9.4.8      Rest of Asia-Pacific

9.4.8.1     By IEEE Standards

9.4.8.2     By Band

9.4.8.3     ByMIMO Configuration

9.4.8.4     By Fabrication Technology

9.4.8.5     By Application

9.5          MEA

9.5.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

9.5.2      GCC Countries

9.5.2.1     By IEEE Standards

9.5.2.2     By Band

9.5.2.3     ByMIMO Configuration

9.5.2.4     By Fabrication Technology

9.5.2.5     By Application

9.5.3      South Africa

9.5.3.1     By IEEE Standards

9.5.3.2     By Band

9.5.3.3     ByMIMO Configuration

9.5.3.4     By Fabrication Technology

9.5.3.5     By Application

9.5.4      Turkey

9.5.4.1     By IEEE Standards

9.5.4.2     By Band

9.5.4.3     ByMIMO Configuration

9.5.4.4     By Fabrication Technology

9.5.4.5     By Application

9.5.5      Rest of MEA

9.5.5.1     By IEEE Standards

9.5.5.2     By Band

9.5.5.3     ByMIMO Configuration

9.5.5.4     By Fabrication Technology

9.5.5.5     By Application

9.6          South America

9.6.1      Market Size and Forecast, 2017–2029 (U.S.D Million)

9.6.2      Brazil

9.6.2.1     By IEEE Standards

9.6.2.2     By Band

9.6.2.3     ByMIMO Configuration

9.6.2.4     By Fabrication Technology

9.6.2.5     By Application

9.6.3      Argentina

9.6.3.1     By IEEE Standards

9.6.3.2     By Band

9.6.3.3     ByMIMO Configuration

9.6.3.4     By Fabrication Technology

9.6.3.5     By Application

9.6.4      Colombia

9.6.4.1     By IEEE Standards

9.6.4.2     By Band

9.6.4.3     ByMIMO Configuration

9.6.4.4     By Fabrication Technology

9.6.4.5     By Application

9.6.5      Rest of South America

9.6.5.1     By IEEE Standards

9.6.5.2     By Band

9.6.5.3     ByMIMO Configuration

9.6.5.4     By Fabrication Technology

9.6.5.5     By Application

9              Company Profile

9.1          Qualcomm

9.1.1      Company Overview

9.1.2      Financial Performance

9.1.3      Recent Developments

9.1.4      Product Portfolio

9.2          Broadcom

9.2.1      Company Overview

9.2.2      Financial Performance

9.2.3      Recent Developments

9.2.4      Product Portfolio

9.3          Intel Corporation

9.3.1      Company Overview

9.3.2      Financial Performance

9.3.3      Recent Developments

9.3.4      Product Portfolio

9.4          MediaTek

9.4.1      Company Overview

9.4.2      Financial Performance

9.4.3      Recent Developments

9.4.4      Product Portfolio

9.5          SAMSUNG

9.5.1      Company Overview

9.5.2      Financial Performance

9.5.3      Recent Developments

9.5.4      Product Portfolio

9.6          STMicroelectronics

9.6.1      Company Overview

9.6.2      Financial Performance

9.6.3      Recent Developments

9.6.4      Product Portfolio

9.7          Cypress (Infineon Technologies)

9.7.1      Company Overview

9.7.2      Financial Performance

9.7.3      Recent Developments

9.7.4      Product Portfolio

9.8          On Semiconductor

9.8.1      Company Overview

9.8.2      Financial Performance

9.8.3      Recent Developments

9.8.4      Product Portfolio

9.9          PerasoTechnologies

9.9.1      Company Overview

9.9.2      Financial Performance

9.9.3      Recent Developments

9.9.4      Product Portfolio

9.10        Dialog Semiconductor

9.10.1    Company Overview

9.10.2    Financial Performance

9.10.3    Recent Developments

9.10.4    Product Portfolio

9.11        Texas Instruments

9.11.1    Company Overview

9.11.2    Financial Performance

9.11.3    Recent Developments

9.11.4    Product Portfolio

9.12        NXP Semicondcutors

9.12.1    Company Overview

9.12.2    Financial Performance

9.12.3    Recent Developments

9.12.4    Product Portfolio

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