Flip Chip Market To Grow In Tandem With Consumer Electronics Sector During Forecast Period

Introduction

In flip chip technology, the entire surface of a dye can be used for interconnection, rather than just the edge. It can support a larger number of interconnects on the same die size, owing to its ability to connect over the surface of the die; thus, flip chip technology maintains high packaging density.

The flip chip technology market is mainly driven by growth in the Internet of Things (IoT) and technological superiority over wire bonding.

Segmental Insights

The global flip chip market can be segmented by product type, packaging technology, bumping technology, and industry.

By packaging technology, the flip chip market can be segmented into 3D IC, 2.5D IC, 2D IC. The  3D IC segment is expected to register the highest growth over the forecast period.

By bumping technology, the market can be segmented into copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder. Copper pillar technology is likely to dominate the flip chip market, owing to extensive applications in transceivers and other application processers.

By industry, the flip chip market can be segmented into consumer electronics, heavy machinery and equipment, IT and telecommunication, automotive, and others. The consumer electronics segment is expected to grow at the highest rate, due to the high adoption rate of consumer electronics around the globe.

Regional Insights

On the basis of geography, the market has been segmented into North America, Asia Pacific, Europe, and LAMEA.

North America is one of the prominent regions in the flip chip market, mainly owing to the strong presence of key players in this region. Countries in Asia Pacific have major manufacturing hubs and provide ample opportunities for market growth. The flip chip market in Europe is expected to grow at a substantial rate, due to early technology adoption in this region. The LAMEA region is expected to register a significant growth rate in the flip chip market, owing to the growing adoption of IoT (Internet of Things).

Competitive Players

1. IBM Corporation
2. Intel Corporation
3. Fujitsu Ltd.
4. 3M
5. Samsung Electronics Co. Ltd.,
6. Amkor Packaging Technology Inc.
7. TSMC Ltd.,Apple Inc.
8. Texas Instruments Inc.
9. AMD Inc.

Recent Developments

Recent Developments

September 2022 - Bharti Airtel, one of India's leading providers of communications services with more than 358 million subscribers, and IBM (NYSE: IBM) today announced their intention to collaborate on the deployment of Airtel's edge computing platform in India, which will include 120 network data centers spread across 20 cities. The platform is intended to allow large businesses in various sectors, including manufacturing and the automotive industry, to accelerate innovative solutions that provide new value to their operations and clients — securely at the edge.

September 2022 - IBM (NYSE: IBM) today unveiled the next generation of its LinuxONE server, a highly scalable Linux and Kubernetes-based platform designed to deliver scalability to support thousands of workloads in the footprint of a single system1. IBM LinuxONE Emperor 4 features capabilities that can reduce clients’ energy consumption. For example, consolidating Linux workloads on five IBM LinuxONE Emperor 4 systems instead of running them on compared x86 servers under similar conditions can reduce energy consumption by 75%, space by 50%, and the CO2e footprint by over 850 metric tons annually2.

Segmentation

1. By Packaging Technology
   1. 3D IC
   2. 5D IC
   3. 2D IC
2. By Bumping Technology
   1. Copper Pillar
   2. Solder Bumping
   3. Tin-lead Eutectic Solder
   4. Lead-free Solder
   5. Gold Bumping
   6. Others (Aluminum & Conductive Polymer)
3. By Packaging Type
   1. FC BGA
   2. FC PGA
   3. FC LGA
   4. FC QFN
   5. FC SiP
   6. FC CSP
4. By Product
   1. Memory
   2. LED
   3. CMOS Image sensor
   4. RF, analog, mixed signal, and power IC
   5. CPU
   6. SoC
   7. GPU
5. By Industry Vertical
   1. Electronics
   2. Industrial
   3. Automotive & Transport
   4. Healthcare
   5. IT & Telecommunication
   6. Aerospace & Defense
   7. Others