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Global Statistics Representing Flip Chip Market Scenario

Flip chip is a packaging technology that interconnects the chip and substrate of a package carrier using a bump. These bumps are placed on a die surface and help make an electrical interconnection between the chip and the package substrate. Any surface of a flip chip can be used for interconnection, generally done through copper, nickel or solder metal bumps. Technological superiority over wire bond connections, increasing demand for high functionality devices, maintaining high packaging density, and increasing reliability of circuits are some of the factors driving the flip chip market.

Flip chips offer a wide variety of benefits as compared to wire-bond packagings, such as substrate flexibility, superior electrical and thermal and electrical performance, high speed and reliability. Current leading-edge flip-chip designs are in production with as many as 5,908 bumps/chip at 200-µm pitch and 1,500 bumps/chip at 170-µm pitch in area array configurations.

One of the factors positively influencing the demand for flip technology is the high functionality of devices such as smartphones, smart warbles, laptops, and other portable devices. Flip chip technology is used to improve existing devices, and flip chip market vendors are now investing in R&D to introduce form factors of different ranges. For example, manufacturers such as Intel, and Samsung electronics have made several announcements to reduce form factor for portable devices.

However, the high cost associated with implementation of flip chip technology and availability of low customization options as compared to wire bonding are expected to hinder market growth to an extent.

The continuously decreasing size of digital devices and growth in demand for sensors in smartphones are anticipated to be key trends in the flip chip market during the forecast period.

Global flip chip technology market was valued at USD 20.61 billion in 2017 and expected to grow at CAGR 5.9% over the forecast period 2019–2026.

Key Target Audience

  • Wafer Manufacturers
  • Raw Material and Manufacturing Equipment Suppliers
  • Chip Manufacturers
  • System Integrators
  • Device Manufacturers
  • Foundry Players
  • Distributors and Retailers
  • Research Organizations

Market Segmentation

The global flip chip market can be segmented on the basis of product, packaging technology, bumping technology, end-use industry, and geography.

On the basis of packaging technology, the market can be segmented into 3D IC, 2.5D IC, 2D IC. The 3D IC segment has been witnessing significant demand due to low power consumption, improved performance and reduced space requirement.

On the basis of bumping technology, the market can be segmented into copper pillar, solder bumping, tin-lead eutectic solder, and lead-free solder. The copper pillar technology dominates the industry with extensive applications in transceivers, embedded processors, and application processors.

On the basis of end-use industry, the market can be segmented into electronics, heavy machinery and equipment, IT and telecommunication, automotive, and others. The increasing demand for smartphones and tablets has been resulting in an increase in the demand for flip chip technology in the electronics industry.

Regional Analysis

By geography, the global flip chip market has been segmented into Asia Pacific, North America, Europe, Latin America, and the Middle East and Africa.

North America is a prominent region in the flip chip technology market, due to the presence of many key players in the region. In addition, high investment in the research and development of flip chip technology is also anticipated to drive market growth in years to come.

Europe is expected to witness considerable growth in the flip chip market due to the use of flip chip technology in consumer electronics and the navy in this region.

Asia Pacific is expected to dominate the global flip chip market with the presence of major manufacturing hubs in emerging economies such as India and China, which are likely to provide significant opportunities for market growth. Furthermore, the increasing demand for consumer electronics such as smartphones, tablets and, most recently, wearable electronics such as smartwatches in the region has also been providing impetus to market growth. Growing disposable income, rising youth population, improving economic conditions and expanding middle class are some of the other factors contributing to market growth.

Latin America and the Middle East and Africa are also expected to witness steady growth in the flip chip market as major players such as Tresky, Amkor Technologies, IBM Corp, and Intel Corp. have registered strong growth over the past few years in dealing with flip chip technology.

Key Players

Some of the prominent players in the global flip chip market include Intel Corporation, IBM Corporation, Amkor Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Texas Instruments Inc., GlobalFoundries U.S. Inc., Stats ChipPAC Ltd, Nepes Pte Ltd., and Powertech Technology

Global Flip Chip Market Segmentation

By Packaging Technology

  • 3D IC
  • 5D IC
  • 2D IC

By Bumping Technology

  • Copper Pillar
  • Solder Bumping
  • Tin-Lead Eutectic Solder
  • Lead-Free Solder

By Industry

  • Electronics
  • Heavy Machinery and Equipment
  • IT and Telecommunication
  • Automotive
  • Others

By Geography

  • North America
  • Asia Pacific
  • Europe
  • LAMEA

Why Buy This Report?

This report offers key insights pertaining to the flip chip market with an emphasis on recent developments across geographies and development strategies adopted by prominent market participants. The following sections have specifically been covered in the report.

  • Competitor Analysis
  • Market Concentration of Top Five Players
  • Potential Ventures


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