March 2026 Panasonic Industry announced an investment of approximately JPY 7.5 billion to establish an additional MEGTRON multilayer circuit-board-material production line at its Guangzhou facility in China. The expansion will support low-transmission-loss substrates used in high-speed network equipment, including routers, servers, base stations, and other advanced communication infrastructure. Initial operations are scheduled for April 2027.
August 2025 Amber Enterprises advanced plans to invest approximately INR 8–9 billion in a copper-clad laminate manufacturing facility in Mysuru, Karnataka. The company sought around 16 acres of land for the proposed plant and applied for support under India’s Electronics Components Manufacturing Scheme, representing an expansion into domestically produced electronic substrate materials and PCB supply-chain components.
June 2025 DuPont introduced and showcased advanced interconnect and circuit-material solutions for high-speed and high-frequency electronics, including Pyralux AP flexible copper-clad laminates and Pyralux ML laminate materials. Pyralux AP was designed to provide reduced transmission loss and high reliability, supporting demanding communication, computing, automotive, and next-generation electronic applications.
May 2025 Uttar Pradesh authorities provisionally allocated land near the Noida International Airport for electronics manufacturing projects involving Amber Enterprises and its associated operations. The proposed investment included facilities for copper-clad laminates, high-density PCBs, PCB assemblies, and related electronic components, with reported plans to explore collaboration with South Korean companies for PCB manufacturing.