May 2026 3M expanded its portfolio of Scotch-Weld™ epoxy adhesives with new structural bonding solutions developed for transportation, renewable energy, and general industrial markets. The expanded range delivers improved bond strength, impact resistance, and processing efficiency for composite materials, metals, and engineered plastics.
February 2026 Henkel expanded its LOCTITE® industrial adhesives portfolio by introducing advanced epoxy formulations for electric vehicle battery assembly and electronics manufacturing. The new products are designed to improve structural integrity, thermal management, and manufacturing efficiency for next-generation mobility and industrial applications.
October 2025 Master Bond Inc. launched EP21TCHT-LO, a two-component epoxy adhesive formulated for high-temperature bonding applications in aerospace, electronics, and medical devices. The new adhesive provides excellent thermal conductivity, chemical resistance, and long-term mechanical performance under demanding operating conditions.
August 2025 H.B. Fuller introduced a next-generation range of high-performance epoxy adhesives engineered for electronics, aerospace, and industrial manufacturing applications. The expanded portfolio offers enhanced thermal stability, chemical resistance, and durability to meet the growing demand for advanced structural bonding solutions.