Radiation-Hardened Electronics for Space Application Market Growth & Share by 2033

Table Of Content

Executive Summary

Research Scope & Segmentation

Research Objectives
Limitations & Assumptions
Market Scope & Segmentation
Currency & Pricing Considered

Market Opportunity Assessment

Emerging Regions / Countries
Emerging Companies
Emerging Applications / End Use

Market Trends

Drivers
Market Warning Factors
Latest Macro Economic Indicators
Geopolitical Impact
Technology Factors

Market Assessment

Porters Five Forces Analysis
Value Chain Analysis

Regulatory Framework

North America
Europe
APAC
Middle East and Africa
LATAM

ESG Trends

Global Radiation-Hardened Electronics for Space Application Market Size Analysis

Global Radiation-Hardened Electronics for Space Application Market Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value

North America Market Analysis

Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value
U.S.
1. By Platform
  1. Introduction
    1. Platform By Value
  2. Satellite
    1. By Value
  3. Launch Vehicle
    1. By Value
  4. Deep Space Probe
    1. By Value
2. By Manufacturing Technique
  1. Introduction
    1. Manufacturing Technique By Value
  2. Rad-Hard by Design
    1. By Value
  3. Rad-Hard by Process
    1. By Value
  4. Rad-Hard by Software
    1. By Value
3. By Material Type
  1. Introduction
    1. Material Type By Value
  2. Silicon
    1. By Value
  3. Gallium Nitride
    1. By Value
  4. Silicon Carbide
    1. By Value
4. By Component
  1. Introduction
    1. Component By Value
  2. Onboard Computer
    1. By Value
  3. Microprocessor
    1. By Value
  4. Controller
    1. By Value
  5. Power Source
    1. By Value
  6. Memory (Solid-State Recorder)
    1. By Value
  7. Field-Programmable Gate Array
    1. By Value
  8. Transmitter and Receiver (Antennas)
    1. By Value
  9. Application-Specific Integrated Circuit
    1. By Value
  10. Sensor
    1. By Value
Canada

Europe Market Analysis

Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value
U.K.
1. By Platform
  1. Introduction
    1. Platform By Value
  2. Satellite
    1. By Value
  3. Launch Vehicle
    1. By Value
  4. Deep Space Probe
    1. By Value
2. By Manufacturing Technique
  1. Introduction
    1. Manufacturing Technique By Value
  2. Rad-Hard by Design
    1. By Value
  3. Rad-Hard by Process
    1. By Value
  4. Rad-Hard by Software
    1. By Value
3. By Material Type
  1. Introduction
    1. Material Type By Value
  2. Silicon
    1. By Value
  3. Gallium Nitride
    1. By Value
  4. Silicon Carbide
    1. By Value
4. By Component
  1. Introduction
    1. Component By Value
  2. Onboard Computer
    1. By Value
  3. Microprocessor
    1. By Value
  4. Controller
    1. By Value
  5. Power Source
    1. By Value
  6. Memory (Solid-State Recorder)
    1. By Value
  7. Field-Programmable Gate Array
    1. By Value
  8. Transmitter and Receiver (Antennas)
    1. By Value
  9. Application-Specific Integrated Circuit
    1. By Value
  10. Sensor
    1. By Value
Germany
France
Spain
Italy
Russia
Nordic
Benelux
Rest of Europe

APAC Market Analysis

Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value
China
1. By Platform
  1. Introduction
    1. Platform By Value
  2. Satellite
    1. By Value
  3. Launch Vehicle
    1. By Value
  4. Deep Space Probe
    1. By Value
2. By Manufacturing Technique
  1. Introduction
    1. Manufacturing Technique By Value
  2. Rad-Hard by Design
    1. By Value
  3. Rad-Hard by Process
    1. By Value
  4. Rad-Hard by Software
    1. By Value
3. By Material Type
  1. Introduction
    1. Material Type By Value
  2. Silicon
    1. By Value
  3. Gallium Nitride
    1. By Value
  4. Silicon Carbide
    1. By Value
4. By Component
  1. Introduction
    1. Component By Value
  2. Onboard Computer
    1. By Value
  3. Microprocessor
    1. By Value
  4. Controller
    1. By Value
  5. Power Source
    1. By Value
  6. Memory (Solid-State Recorder)
    1. By Value
  7. Field-Programmable Gate Array
    1. By Value
  8. Transmitter and Receiver (Antennas)
    1. By Value
  9. Application-Specific Integrated Circuit
    1. By Value
  10. Sensor
    1. By Value
Korea
Japan
India
Australia
Taiwan
South East Asia
Rest of Asia-Pacific

Middle East and Africa Market Analysis

Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value
UAE
1. By Platform
  1. Introduction
    1. Platform By Value
  2. Satellite
    1. By Value
  3. Launch Vehicle
    1. By Value
  4. Deep Space Probe
    1. By Value
2. By Manufacturing Technique
  1. Introduction
    1. Manufacturing Technique By Value
  2. Rad-Hard by Design
    1. By Value
  3. Rad-Hard by Process
    1. By Value
  4. Rad-Hard by Software
    1. By Value
3. By Material Type
  1. Introduction
    1. Material Type By Value
  2. Silicon
    1. By Value
  3. Gallium Nitride
    1. By Value
  4. Silicon Carbide
    1. By Value
4. By Component
  1. Introduction
    1. Component By Value
  2. Onboard Computer
    1. By Value
  3. Microprocessor
    1. By Value
  4. Controller
    1. By Value
  5. Power Source
    1. By Value
  6. Memory (Solid-State Recorder)
    1. By Value
  7. Field-Programmable Gate Array
    1. By Value
  8. Transmitter and Receiver (Antennas)
    1. By Value
  9. Application-Specific Integrated Circuit
    1. By Value
  10. Sensor
    1. By Value
Turkey
Saudi Arabia
South Africa
Egypt
Nigeria
Rest of MEA

LATAM Market Analysis

Introduction
By Platform
1. Introduction
  1. Platform By Value
2. Satellite
  1. By Value
3. Launch Vehicle
  1. By Value
4. Deep Space Probe
  1. By Value
By Manufacturing Technique
1. Introduction
  1. Manufacturing Technique By Value
2. Rad-Hard by Design
  1. By Value
3. Rad-Hard by Process
  1. By Value
4. Rad-Hard by Software
  1. By Value
By Material Type
1. Introduction
  1. Material Type By Value
2. Silicon
  1. By Value
3. Gallium Nitride
  1. By Value
4. Silicon Carbide
  1. By Value
By Component
1. Introduction
  1. Component By Value
2. Onboard Computer
  1. By Value
3. Microprocessor
  1. By Value
4. Controller
  1. By Value
5. Power Source
  1. By Value
6. Memory (Solid-State Recorder)
  1. By Value
7. Field-Programmable Gate Array
  1. By Value
8. Transmitter and Receiver (Antennas)
  1. By Value
9. Application-Specific Integrated Circuit
  1. By Value
10. Sensor
  1. By Value
Brazil
1. By Platform
  1. Introduction
    1. Platform By Value
  2. Satellite
    1. By Value
  3. Launch Vehicle
    1. By Value
  4. Deep Space Probe
    1. By Value
2. By Manufacturing Technique
  1. Introduction
    1. Manufacturing Technique By Value
  2. Rad-Hard by Design
    1. By Value
  3. Rad-Hard by Process
    1. By Value
  4. Rad-Hard by Software
    1. By Value
3. By Material Type
  1. Introduction
    1. Material Type By Value
  2. Silicon
    1. By Value
  3. Gallium Nitride
    1. By Value
  4. Silicon Carbide
    1. By Value
4. By Component
  1. Introduction
    1. Component By Value
  2. Onboard Computer
    1. By Value
  3. Microprocessor
    1. By Value
  4. Controller
    1. By Value
  5. Power Source
    1. By Value
  6. Memory (Solid-State Recorder)
    1. By Value
  7. Field-Programmable Gate Array
    1. By Value
  8. Transmitter and Receiver (Antennas)
    1. By Value
  9. Application-Specific Integrated Circuit
    1. By Value
  10. Sensor
    1. By Value
Mexico
Argentina
Chile
Colombia
Rest of LATAM

Competitive Landscape

Radiation-Hardened Electronics for Space Application Market Share By Players
M&A Agreements & Collaboration Analysis

Market Players Assessment

3D Plus
1. Overview
2. Business Information
3. Revenue
4. ASP
5. SWOT Analysis
6. Recent Developments
Analog Devices Inc.
Apogee Semiconductor
Cobham Plc
Data Device Corporation
Exxelia
General Dynamics
GSI Technology Inc.
Infineon Technologies
Mercury Systems Inc.
Microchip Technology Inc.
Micropac Industries
Renesas Electronics Corporation
Solid State Devices Inc.
STMicroelectronics N.V.
Teledyne Technologies
Texas Instruments
Vorago Technologies
Xilinx Inc

Research Methodology

Research Data
1. Secondary Data
  1. Major secondary sources
  2. Key data from secondary sources
2. Primary Data
  1. Key data from primary sources
  2. Breakdown of primaries
3. Secondary And Primary Research
  1. Key industry insights
Market Size Estimation
1. Bottom-Up Approach
2. Top-Down Approach
3. Market Projection
Research Assumptions
1. Assumptions
Limitations
Risk Assessment