Home Aerospace & Defense Space Technologies Radiation-Hardened Electronics for Space Application Market

Radiation-Hardened Electronics for Space Application Market Size, Share & Trends Analysis Report By Platform (Satellite, Launch Vehicle, Deep Space Probe), By Manufacturing Technique (Rad-Hard by Design, Rad-Hard by Process, Rad-Hard by Software), By Material Type (Silicon, Gallium Nitride, Silicon Carbide), By Component (Onboard Computer, Microprocessor, Controller, Power Source, Memory (Solid-State Recorder), Field-Programmable Gate Array, Transmitter and Receiver (Antennas), Application-Specific Integrated Circuit, Sensor) and By Country (U.S., Canada) Forecasts, 2026-2034

Last Updated: July 09, 2026 | Author: Pavan Warade | Format:
Overview TOC Segmentation Methodology
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Market Segmentation

  1. Radiation-Hardened Electronics for Space Application Market, By Platform 2022-2034 (USD MILLION/ Units)
    1. Satellite
    2. Launch Vehicle
    3. Deep Space Probe
  2. Radiation-Hardened Electronics for Space Application Market, By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
    1. Rad-Hard by Design
    2. Rad-Hard by Process
    3. Rad-Hard by Software
  3. Radiation-Hardened Electronics for Space Application Market, By Material Type 2022-2034 (USD MILLION/ Units)
    1. Silicon
    2. Gallium Nitride
    3. Silicon Carbide
  4. Radiation-Hardened Electronics for Space Application Market, By Component 2022-2034 (USD MILLION/ Units)
    1. Onboard Computer
    2. Microprocessor
    3. Controller
    4. Power Source
    5. Memory (Solid-State Recorder)
    6. Field-Programmable Gate Array
    7. Transmitter and Receiver (Antennas)
    8. Application-Specific Integrated Circuit
    9. Sensor
  5. Regional Radiation-Hardened Electronics for Space Application Market
    1. North America
      1. North America Radiation-Hardened Electronics for Space Application Market By Platform 2022-2034 (USD MILLION/ Units)
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
      2. North America Radiation-Hardened Electronics for Space Application Market By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
        1. Rad-Hard by Design
        2. Rad-Hard by Process
        3. Rad-Hard by Software
      3. North America Radiation-Hardened Electronics for Space Application Market By Material Type 2022-2034 (USD MILLION/ Units)
        1. Silicon
        2. Gallium Nitride
        3. Silicon Carbide
      4. North America Radiation-Hardened Electronics for Space Application Market By Component 2022-2034 (USD MILLION/ Units)
        1. Onboard Computer
        2. Microprocessor
        3. Controller
        4. Power Source
        5. Memory (Solid-State Recorder)
        6. Field-Programmable Gate Array
        7. Transmitter and Receiver (Antennas)
        8. Application-Specific Integrated Circuit
        9. Sensor
      5. U.S.
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      6. Canada
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
    2. Europe
      1. Europe Radiation-Hardened Electronics for Space Application Market By Platform 2022-2034 (USD MILLION/ Units)
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
      2. Europe Radiation-Hardened Electronics for Space Application Market By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
        1. Rad-Hard by Design
        2. Rad-Hard by Process
        3. Rad-Hard by Software
      3. Europe Radiation-Hardened Electronics for Space Application Market By Material Type 2022-2034 (USD MILLION/ Units)
        1. Silicon
        2. Gallium Nitride
        3. Silicon Carbide
      4. Europe Radiation-Hardened Electronics for Space Application Market By Component 2022-2034 (USD MILLION/ Units)
        1. Onboard Computer
        2. Microprocessor
        3. Controller
        4. Power Source
        5. Memory (Solid-State Recorder)
        6. Field-Programmable Gate Array
        7. Transmitter and Receiver (Antennas)
        8. Application-Specific Integrated Circuit
        9. Sensor
      5. U.K.
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      6. Germany
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      7. France
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      8. Spain
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      9. Italy
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      10. Russia
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      11. Nordic
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      12. Benelux
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      13. Rest of Europe
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
    3. APAC
      1. APAC Radiation-Hardened Electronics for Space Application Market By Platform 2022-2034 (USD MILLION/ Units)
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
      2. APAC Radiation-Hardened Electronics for Space Application Market By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
        1. Rad-Hard by Design
        2. Rad-Hard by Process
        3. Rad-Hard by Software
      3. APAC Radiation-Hardened Electronics for Space Application Market By Material Type 2022-2034 (USD MILLION/ Units)
        1. Silicon
        2. Gallium Nitride
        3. Silicon Carbide
      4. APAC Radiation-Hardened Electronics for Space Application Market By Component 2022-2034 (USD MILLION/ Units)
        1. Onboard Computer
        2. Microprocessor
        3. Controller
        4. Power Source
        5. Memory (Solid-State Recorder)
        6. Field-Programmable Gate Array
        7. Transmitter and Receiver (Antennas)
        8. Application-Specific Integrated Circuit
        9. Sensor
      5. China
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      6. Korea
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      7. Japan
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      8. India
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      9. Australia
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      10. Taiwan
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      11. South East Asia
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      12. Rest of Asia-Pacific
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
    4. Middle East and Africa
      1. Middle East and Africa Radiation-Hardened Electronics for Space Application Market By Platform 2022-2034 (USD MILLION/ Units)
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
      2. Middle East and Africa Radiation-Hardened Electronics for Space Application Market By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
        1. Rad-Hard by Design
        2. Rad-Hard by Process
        3. Rad-Hard by Software
      3. Middle East and Africa Radiation-Hardened Electronics for Space Application Market By Material Type 2022-2034 (USD MILLION/ Units)
        1. Silicon
        2. Gallium Nitride
        3. Silicon Carbide
      4. Middle East and Africa Radiation-Hardened Electronics for Space Application Market By Component 2022-2034 (USD MILLION/ Units)
        1. Onboard Computer
        2. Microprocessor
        3. Controller
        4. Power Source
        5. Memory (Solid-State Recorder)
        6. Field-Programmable Gate Array
        7. Transmitter and Receiver (Antennas)
        8. Application-Specific Integrated Circuit
        9. Sensor
      5. UAE
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      6. Turkey
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      7. Saudi Arabia
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      8. South Africa
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      9. Egypt
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      10. Nigeria
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      11. Rest of MEA
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
    5. LATAM
      1. LATAM Radiation-Hardened Electronics for Space Application Market By Platform 2022-2034 (USD MILLION/ Units)
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
      2. LATAM Radiation-Hardened Electronics for Space Application Market By Manufacturing Technique 2022-2034 (USD MILLION/ Units)
        1. Rad-Hard by Design
        2. Rad-Hard by Process
        3. Rad-Hard by Software
      3. LATAM Radiation-Hardened Electronics for Space Application Market By Material Type 2022-2034 (USD MILLION/ Units)
        1. Silicon
        2. Gallium Nitride
        3. Silicon Carbide
      4. LATAM Radiation-Hardened Electronics for Space Application Market By Component 2022-2034 (USD MILLION/ Units)
        1. Onboard Computer
        2. Microprocessor
        3. Controller
        4. Power Source
        5. Memory (Solid-State Recorder)
        6. Field-Programmable Gate Array
        7. Transmitter and Receiver (Antennas)
        8. Application-Specific Integrated Circuit
        9. Sensor
      5. Brazil
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      6. Mexico
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      7. Argentina
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      8. Chile
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      9. Colombia
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
      10. Rest of LATAM
        1. Satellite
        2. Launch Vehicle
        3. Deep Space Probe
        4. Rad-Hard by Design
        5. Rad-Hard by Process
        6. Rad-Hard by Software
        7. Silicon
        8. Gallium Nitride
        9. Silicon Carbide
        10. Onboard Computer
        11. Microprocessor
        12. Controller
        13. Power Source
        14. Memory (Solid-State Recorder)
        15. Field-Programmable Gate Array
        16. Transmitter and Receiver (Antennas)
        17. Application-Specific Integrated Circuit
        18. Sensor
Report Details
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