01 Rapid adoption of hybrid and fine-pitch bonding The market is shifting towards advanced, high-margin solutions like hybrid and fine-pitch bonding, in place of classic wire and die attach methods. This trend is driven by the demand for stacked memory and chiplet architectures in high-performance computing, such as High Bandwidth Memory (HBM) and logic for AI. For example, in June 2025, BE Semiconductor Industries (Besi) reported a rise in bookings for hybrid-bonding tools for HBM and logic applications, which they explicitly linked to AI and data-centre demand, and chip stacking requirements. This shift increases the unit cost of bonding equipment. It raises the value of advanced bonding services, as leading OSATs like ASE and Amkor are heavily investing in new capacity to meet this demand.
May 2026 Imec and EV Group demonstrated wafer-to-wafer hybrid bonding with a 200 nm copper interconnect pitch and record post-bond alignment accuracy. The collaboration supports advanced logic-to-logic and memory-to-logic 3D semiconductor integration.
May 2026 ASMPT highlighted its LITHOBOLT die-to-wafer bonding solution and FIREBIRD thermocompression bonding platforms for AI accelerators, HBM, and chiplet architectures. The systems support ultra-fine-pitch and high-density semiconductor integration.
September 2025 EV Group achieved a hybrid bonding overlay-control breakthrough using its EVG40 D2W metrology system. The technology enables high-throughput die overlay measurement to improve process control and yield in chiplet and advanced 3D integration.