Semiconductor Bonding Market Size, Share & Trends Analysis Report By Bonding Technology (Wire bonding, Flip-chip bonding, Die-attach, Thermosonic / Ultrasonic bonding, Thermo-compression bonding (TCB) / hybrid bonding, Wafer-level bonding), By Materials (Bonding wires, Solder pastes and preforms, Conductive adhesives / silver epoxies, Fluxes, underfills, thermal interface materials), By Packaging Type (Traditional leadframe packages (QFN, SOIC), Flip-chip BGA and CSP, Wafer-level packages (WLP, fan-in/fan-out), 5D/3D packages and HBM stacks (chiplets, interposers), System-in-Package (SiP)), By End-Use Industry (Data center and AI accelerators, Consumer electronics and mobile, Automotive (power electronics, ADAS), Telecommunications (5G/6G), Industrial, Medical, Aerospace and Defense) and By Region (North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2026-2034