March 2026 TSMC expanded its advanced semiconductor packaging ecosystem with increased investment in next-generation substrate technologies, including advanced packaging solutions designed to support high-performance computing, artificial intelligence, and chiplet-based architectures.
January 2026 Intel expanded its advanced packaging capabilities with new substrate and interconnect technologies to support next-generation processors, AI accelerators, and high-performance computing applications.
October 2025 GlobalWafers expanded its semiconductor wafer manufacturing capabilities with investments in advanced substrate and silicon wafer production capacity to support growing demand from automotive, AI, and semiconductor applications.
August 2025 Resonac expanded its semiconductor materials portfolio with advanced packaging materials and substrate-related solutions designed for high-performance semiconductor devices and AI computing applications.