Molded Interconnect Device (MID) Market Size & Outlook, 2026-2034

Molded Interconnect Device (MID) Market Overview

The global molded interconnect device (MID) market size is valued at USD 2.91 billion in 2025 and is estimated to reach USD 8.2 billion by 2034, growing at a CAGR of 12.9% during the forecast period. Consistent growth of the market is supported by the increasing adoption of compact and multi-functional electronic designs, which enable higher integration of components, reduce device size and weight, and encourage manufacturers across healthcare, automotive, consumer electronics, and telecommunications to implement MID solutions proactively.

Key Market Trends & Insights

• North America dominated the market with a revenue share of 35.42% in 2025.
• Asia Pacific is anticipated to grow at the fastest CAGR of 13.1% during the forecast period.
• Based on Manufacturing Process, the Laser Direct Structuring (LDS) segment held the highest market share of 57.83% in 2025.
• By Product Type, the Antennae & Connectivity Modules segment held the highest market share of 32.35% in 2025.
• Based on End-Use Industry, the Automotive segment is estimated to register the fastest CAGR of 13.2% during the forecast period.
• The U.S. dominates the MID market, valued at USD 1.61 billion in 2024 and reaching USD 1.93 billion in 2025.

Table: U.S Molded Interconnect Device (MID) Market Size (USD Million)

Source: Straits Research

Market Size & Forecast

• 2025 Market Size: USD 2.91 billion
• 2034 Projected Market Size: USD 8.2 billion
• CAGR (2026-2034): 12.9%
• Dominating Region: North America
• Fastest-Growing Region: Asia Pacific

The Global Molded Interconnect Device (MID) market encompasses a broad range of manufacturing processes, including Laser Direct Structuring (LDS), Two-Shot Molding, Film Back Injection Molding, and other advanced fabrication techniques. These products are delivered through various types such as Antennae & Connectivity Modules, Switches, Sensors, and Lighting Systems, serving diverse end-use industries including Healthcare, Automotive, Consumer Electronics, Telecommunication, and Aerospace & Defense. Furthermore, MID solutions are provided by a variety of manufacturers, technology integrators, and system providers, addressing the electronic design and miniaturization needs of clients through high-precision, technology-driven solutions across global market.

Latest Market Trends

Transition from Conventional PCBs to Integrated MID Approach

The network of suppliers in the electronics industry is moving from bulky printed circuit boards (PCBs) to the Molds Interconnect Devices (MID) in order to facilitate space-saving, multifunctional designs. The traditional multi-layer assemblies are no longer the only option because MID has the capability to merge antennas, sensors, and connectivity modules along with the manufacturing of components.

This change makes it easier to assemble, and the weight is lighter, which brings about the reliability of the device. Those companies who have moved to the integrated approach have observed quicker prototyping, better signal performance, and greater overall design flexibility, indicating a strong tendency towards highly miniaturized, and system-in-package electronic goods.

Greater Acceptance in Automotive Electronics

The Automotive industry is making more use of MID technology for the connectivity inside the car, the advanced driver-assistance systems (ADAS), and the electronic control units among the applications. The trend towards electric vehicles (EVs) and smart mobility has made the demand for electronic components that are small, light, and have multiple functions even stronger. The use of MID in car electronics not only increases the energy efficiency but also simplifies the wiring and paves the way for the next generation of infotainment and telematics systems, thereby causing a significant increase in this end-use segment.

To get more insights about this report Download Free Sample Report

Market Driver

National Programs for 5G and Advanced Connectivity

Many governments are investing in 5G infrastructure and IoT networks to facilitate connectivity at high speed. China's deployment of 5G looks to reach more than 1 million base stations by 2025, and the European Union is funding next-generation electronics through the Digital Europe Program for industrial and consumer applications. MID solutions with embedded antennas and connectivity modules are crucial to meeting the compact design and high-frequency requirements for these national initiatives and thus create a substantial market pull.

Market Restraint

Limited Standardization Across MID Components Hampers Adoption

The key restraint in the Molded Interconnect Device market is that there are no standards or interoperability protocols within the industry for MID components. Unlike conventional PCBs, MID solutions are more customized for specific applications, making integrations across different devices and manufacturers convoluted. This complicates global supply chain alignment in terms of system compatibility. Government agencies and industry bodies like the IEC and the U.S. NIST have recognized the requirement for standardized MID design and test methodologies. Current regulatory and standardization efforts are still in their initial phases, though, making it hard for manufacturers to scale up production uniformly.

Market Opportunity

Expansion through Smart Urban Mobility Initiatives

The growing implementation of intelligent urban mobility solutions offers the MID market significant opportunities. Investment in intelligent transportation systems, connected public transit, and smart parking infrastructure is a priority for cities across Europe and Asia, and all require compact, integrated electronic modules for V2X communication and onboard control systems. Leading automotive integrators have started to implement MID-based modules in electric buses and autonomous shuttles, making possible lightweight, multifunctional electronic systems that reduce wiring complexity and enhance reliability. Such adoptions not only support sustainable urban mobility goals but also open up a scalable market for the supply of high-volume, integrated solutions by MID manufacturers for next-generation smart cities.

Regional Analysis

North America accounted for the largest market share of 35.42% in 2025 due to increasing demand for connected and electric vehicles, miniaturized consumer electronics, and next-generation telecommunication infrastructure, which calls for small but powerful electronic modules. Due to the close collaboration of the MID manufacturers with key technology integrators, MID solution deployment in automotive and IoT devices has gained momentum. These factors collectively contribute to increased MID adoption in North American countries.

The growth of the MID market in the U.S. is driven by increasing demands for lightweight and multi-functional electronic components in vehicles and consumer electronics. Major automotive OEMs, for instance, have integrated MID-based antenna and sensor modules into their newer generations of in-vehicle infotainment and ADAS systems to reduce wiring complexity and enhance system reliability. Meanwhile, several leading electronics manufacturers have introduced high-density MID components for use in smart home and wearable devices, further fostering market penetration. Advancement in design efficiency and multi-function integration becomes the key driver for increasing confidence in MID solutions, hence underpinning the high growth rate of the market in the United States.

Asia Pacific MID Market Insights

This is the fastest-growing region at a CAGR of 13.1% from 2026-2034, driven by countries like China, Japan, and South Korea, emerging as hubs for the manufacturing of consumer electronics, electric vehicle production, and industrial automation applications. The technology finds increased usage in compact devices, automotive modules, and IoT equipment. Regional manufacturers are focusing on scalable production capabilities together with cross-industry collaboration, thus accelerating the adoption of MID and presenting a strong environment for the continued growth of this market.

The MID market in India will see rapid growth owing to the increasing demand from automotive electronics, consumer electronics, and telecom infrastructure. The integration of MID components into EVs, smart devices, and industrial sensors is increasingly being considered by companies to achieve better performance with less manufacturing complexity. Most domestic MID suppliers have scaled up their production and collaborated with global OEMs, thereby making more high-quality MID components available at competitive costs. All these factors-escalating demand, manufacturing capacity, and strategic collaborations-are positioning India as a major growth hub in the Asia Pacific MID market.

Regional Market share (%) in 2025

Source: Straits Research

Europe MID Market Insights

Steady growth in the MID market is observed in Europe, driven by strong adoptions of electric vehicles, smart home electronics, and industrial automation. Countries such as France, the U.K., and Italy are investing in clusters of advanced electronics manufacturing, supporting local MID suppliers and accelerating the pace of adoption in automotive and consumer electronics industries. This collaboration between design houses and manufacturing firms has enabled rapid prototyping and deployment of high-performance MID components, thus boosting the market growth in this region.

In Germany, the growth drivers for the MID market are the integration of lightweight, multifunctional electronics in automotive and industrial systems. Major automotive OEMs, like BMW and Volkswagen, have implemented MID-based antenna and sensor modules in connected vehicles and ADAS systems for weight and space optimization. Partnerships between electronics manufacturers and Tier-1 automotive suppliers have improved scalability and quality standards in production, extending the industrial scope and penetration of MID solutions across German manufacturing networks.

Latin America Molded Interconnect Device (MID) Market Insights

The regional MID market is driven by countries like Brazil, Mexico, and Argentina with increasing adoption of industrial automation and connected devices, hence creating demand for compact, high-performance MID components. Local electronics manufacturers are making use of cost-effective production capabilities to supply automotive, telecommunication, and consumer electronics segments, thus promoting wider regional adoption of MID technology.

The market for MID is growing in Brazil due to the adoption by manufacturers of MID-based solutions to reduce wiring complexity and improve miniaturization in automotive and consumer electronics. Leading electronics integrators are collaborating with OEMs in the development of embedded antenna and sensor modules for connected vehicles and IoT devices, which accelerates the adoption across commercial and industrial applications. Such innovation coupled with scalable production is positioning Brazil as one of the key growth hubs in the Latin America MID market.

Middle East and Africa Market Insights

The Middle East and Africa MID market is growing, with countries like UAE, Saudi Arabia, and South Africa investing in various projects pertaining to industrial automation, defense electronics, and smart infrastructure. The adoption of MID continues to grow due to increasing demand for lightweight, multi-functional electronics in the aerospace, telecommunications, and automotive sectors. Besides, regional electronics integrators are developing local capabilities to support supply chain efficiency and market expansion.

South Africa continues to present potential in the MID market, reflecting overall growth on account of increasing investments in connected industrial systems, automotive electronics, and defense equipment. Applications in MID-based modules by local manufacturers and international technology partners are being used to help further enhance system reliability, save space, and boost performance across high-demand sectors. In addition, these developments ensure wider regional adoption and represent South Africa as a major growth market in the Middle East and Africa region.

Manufacturing Process Insights

The laser direct structuring (LDS) segment accounted for 57.83% of revenue in the market in 2025. Its high growth is attributed to its greater precision in making complex 3D circuitry on molded plastic parts to reduce the complexity in the integration of components and enhance the performance of signals across end verticals, including automotive electronics and telecommunications modules.

The two-shot molding segment is expected to show the quickest growth, projecting a CAGR of about 11.2% during the forecast period. High growth is driven by increasing adoption in consumer electronics and medical devices where integration of multiple materials in a single molded component improves device miniaturization and manufacturing efficiency.

By Manufacturing Process Market Share (%), 2025

Source: Straits Research

Product Type Insights

The segment of Antennae & Connectivity Modules accounted for the lion's share of 32.35% in the market in 2025. These modules integrate necessary communication, sensing, and connectivity functions into compact, high-performance MID components.

The segment of Sensors is expected to exhibit the highest growth in the forecast period. The increased usage of MID-based sensors for medical devices, industrial automation, and IoT-enabled consumer electronics drives the growth.

End-Use Industry Insights

The Automotive segment is expected to record a CAGR of 8.9% in the forecast period due to increased EV adoption and ADAS. Since automotive manufacturers are striving for weight reduction and the integration of more functionality into electronic modules, MID solutions find widespread applications in antennas, sensors, and control systems. The demand for compact, high-performance electronic components increases tremendously; hence, growth within the automotive sector has been accelerating.

Competitive Landscape

The Global Molded Interconnect Device (MID) Market is moderately fragmented, with several well-established electronics manufacturers and specialized solution providers. Few players hold the major market share by benefiting from their large product portfolio, advanced manufacturing capabilities, and close relationships with clients.

Major players operating in this market include Multec, AT&S AG, Hutchinson Group among others. Industry players are trying to establish a strong foothold in the market by launching new MID products, strategic partnerships, mergers, and acquisitions, and expansion into emerging end-use sectors.

TactoTek Oy: An Emerging Market Player

TactoTek Oy is positioning itself as a rising competitor in the global MID market, based on its experience and specialization in IMSE® for MID applications.

• In June 2025, the company announced a product launch of an automotive grade, high-volume IMSE module that integrates antenna, connectivity, and lighting functions into a single molded device for premium vehicle interiors. This launch is expected to yield over 2 million units annually by 2026, targeting the European EV and luxury segment.

The move highlights how TactoTek is rapidly transitioning from an R&D specialist to a high-volume MID supplier, with scale necessary for denting incumbent players through its integrated structural-electronics offer.

List of key players in Molded Interconnect Device (MID) Market

1. Multec
2. AT&S AG
3. Hutchinson Group
4. Würth Elektronik
5. Molex
6. Hitachi Chemical
7. Nanotech Electronics
8. Celestica Inc.
9. TDK Corporation
10. APTIV PLC
11. Showa Denko K.K.
12. BASF SE
13. Sumitomo Electric Industries
14. Technica Co., Ltd.
15. Infineon Technologies AG
16. Amphenol Corporation
17. Jabil Inc.
18. Würth Elektronik EiSos GmbH & Co. KG
19. NedCard BV
20. TE Connectivity Ltd.
21. Others

To get more findings about this report Download Market Share

Strategic Initiatives

• September 2025: Cogenuity Partners, a U.S.-based private equity firm, acquired Interconnect Solutions Company (ISC), a provider of custom and complex interconnect solutions, including custom overmolded solutions and molded strain reliefs. This acquisition enhances Cogenuity's advanced industrial portfolio, specifically within the high-performance connectivity sector serving markets like aerospace and data centers.
• August 2025: AT&S launched the “HiPower 5.0” research project focused on compact drive-solutions and integrated MID modules for sustainable mobility in automotive and shipping sectors.
• April 2025: MacDermid Enthone Industrial Solutions (a unit of Element Solutions Inc.) announced a strategic investment in Recubrimientos Metálicos de México (RM Plating) in Irapuato, Mexico. Production began in February 2025 with four state-of-the-art production lines focused on high-performance plating solutions used in MID manufacturing for automotive and industrial electronics.
• March 2025: HARTING Technology Group announced advancements in 3D-MID applications for consumer electronics, highlighting miniaturization and multifunctional integration. The company emphasized its role in transforming device architecture through 3D circuit carriers.