Molded Interconnect Device (MID) Market Size, Share & Growth Report by 2034

Table Of Content

Executive Summary

Research Scope & Segmentation

Research Objectives
Limitations & Assumptions
Market Scope & Segmentation
Currency & Pricing Considered

Market Opportunity Assessment

Emerging Regions / Countries
Emerging Companies
Emerging Applications / End Use

Market Trends

Drivers
Market Warning Factors
Latest Macro Economic Indicators
Geopolitical Impact
Technology Factors

Market Assessment

Porters Five Forces Analysis
Value Chain Analysis

Regulatory Framework

North America
Europe
APAC
Middle East and Africa
LATAM

ESG Trends

Global Molded Interconnect Device (MID) Market Size Analysis

Global Molded Interconnect Device (MID) Market Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value

North America Market Analysis

Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value
U.S.
1. By Manufacturing Process
  1. Introduction
    1. Manufacturing Process By Value
  2. Laser Direct Structuring (LDS)
    1. By Value
  3. Two-Shot Molding
    1. By Value
  4. Film Back Injection Molding
    1. By Value
  5. Others
    1. By Value
2. By Product Type
  1. Introduction
    1. Product Type By Value
  2. Antennae & Connectivity Modules
    1. By Value
  3. Switches
    1. By Value
  4. Sensors
    1. By Value
  5. Lighting Systems
    1. By Value
  6. Others
    1. By Value
3. By End Use Industry
  1. Introduction
    1. End Use Industry By Value
  2. Healthcare
    1. By Value
  3. Automotive
    1. By Value
  4. Consumer Electronics
    1. By Value
  5. Telecommunication
    1. By Value
  6. Aerospace and Defense
    1. By Value
Canada

Europe Market Analysis

Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value
U.K.
1. By Manufacturing Process
  1. Introduction
    1. Manufacturing Process By Value
  2. Laser Direct Structuring (LDS)
    1. By Value
  3. Two-Shot Molding
    1. By Value
  4. Film Back Injection Molding
    1. By Value
  5. Others
    1. By Value
2. By Product Type
  1. Introduction
    1. Product Type By Value
  2. Antennae & Connectivity Modules
    1. By Value
  3. Switches
    1. By Value
  4. Sensors
    1. By Value
  5. Lighting Systems
    1. By Value
  6. Others
    1. By Value
3. By End Use Industry
  1. Introduction
    1. End Use Industry By Value
  2. Healthcare
    1. By Value
  3. Automotive
    1. By Value
  4. Consumer Electronics
    1. By Value
  5. Telecommunication
    1. By Value
  6. Aerospace and Defense
    1. By Value
Germany
France
Spain
Italy
Russia
Nordic
Benelux
Rest of Europe

APAC Market Analysis

Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value
China
1. By Manufacturing Process
  1. Introduction
    1. Manufacturing Process By Value
  2. Laser Direct Structuring (LDS)
    1. By Value
  3. Two-Shot Molding
    1. By Value
  4. Film Back Injection Molding
    1. By Value
  5. Others
    1. By Value
2. By Product Type
  1. Introduction
    1. Product Type By Value
  2. Antennae & Connectivity Modules
    1. By Value
  3. Switches
    1. By Value
  4. Sensors
    1. By Value
  5. Lighting Systems
    1. By Value
  6. Others
    1. By Value
3. By End Use Industry
  1. Introduction
    1. End Use Industry By Value
  2. Healthcare
    1. By Value
  3. Automotive
    1. By Value
  4. Consumer Electronics
    1. By Value
  5. Telecommunication
    1. By Value
  6. Aerospace and Defense
    1. By Value
Korea
Japan
India
Australia
Taiwan
South East Asia
Rest of Asia-Pacific

Middle East and Africa Market Analysis

Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value
UAE
1. By Manufacturing Process
  1. Introduction
    1. Manufacturing Process By Value
  2. Laser Direct Structuring (LDS)
    1. By Value
  3. Two-Shot Molding
    1. By Value
  4. Film Back Injection Molding
    1. By Value
  5. Others
    1. By Value
2. By Product Type
  1. Introduction
    1. Product Type By Value
  2. Antennae & Connectivity Modules
    1. By Value
  3. Switches
    1. By Value
  4. Sensors
    1. By Value
  5. Lighting Systems
    1. By Value
  6. Others
    1. By Value
3. By End Use Industry
  1. Introduction
    1. End Use Industry By Value
  2. Healthcare
    1. By Value
  3. Automotive
    1. By Value
  4. Consumer Electronics
    1. By Value
  5. Telecommunication
    1. By Value
  6. Aerospace and Defense
    1. By Value
Turkey
Saudi Arabia
South Africa
Egypt
Nigeria
Rest of MEA

LATAM Market Analysis

Introduction
By Manufacturing Process
1. Introduction
  1. Manufacturing Process By Value
2. Laser Direct Structuring (LDS)
  1. By Value
3. Two-Shot Molding
  1. By Value
4. Film Back Injection Molding
  1. By Value
5. Others
  1. By Value
By Product Type
1. Introduction
  1. Product Type By Value
2. Antennae & Connectivity Modules
  1. By Value
3. Switches
  1. By Value
4. Sensors
  1. By Value
5. Lighting Systems
  1. By Value
6. Others
  1. By Value
By End Use Industry
1. Introduction
  1. End Use Industry By Value
2. Healthcare
  1. By Value
3. Automotive
  1. By Value
4. Consumer Electronics
  1. By Value
5. Telecommunication
  1. By Value
6. Aerospace and Defense
  1. By Value
Brazil
1. By Manufacturing Process
  1. Introduction
    1. Manufacturing Process By Value
  2. Laser Direct Structuring (LDS)
    1. By Value
  3. Two-Shot Molding
    1. By Value
  4. Film Back Injection Molding
    1. By Value
  5. Others
    1. By Value
2. By Product Type
  1. Introduction
    1. Product Type By Value
  2. Antennae & Connectivity Modules
    1. By Value
  3. Switches
    1. By Value
  4. Sensors
    1. By Value
  5. Lighting Systems
    1. By Value
  6. Others
    1. By Value
3. By End Use Industry
  1. Introduction
    1. End Use Industry By Value
  2. Healthcare
    1. By Value
  3. Automotive
    1. By Value
  4. Consumer Electronics
    1. By Value
  5. Telecommunication
    1. By Value
  6. Aerospace and Defense
    1. By Value
Mexico
Argentina
Chile
Colombia
Rest of LATAM

Competitive Landscape

Molded Interconnect Device (MID) Market Share By Players
M&A Agreements & Collaboration Analysis

Market Players Assessment

Multec
1. Overview
2. Business Information
3. Revenue
4. ASP
5. SWOT Analysis
6. Recent Developments
AT&S AG
Hutchinson Group
Würth Elektronik
Molex
Hitachi Chemical
Nanotech Electronics
Celestica Inc.
TDK Corporation
APTIV PLC
Showa Denko K.K.
BASF SE
Sumitomo Electric Industries
Technica Co., Ltd.
Infineon Technologies AG
Amphenol Corporation
Jabil Inc.
Würth Elektronik EiSos GmbH & Co. KG
NedCard BV
TE Connectivity Ltd.
Others

Research Methodology

Research Data
1. Secondary Data
  1. Major secondary sources
  2. Key data from secondary sources
2. Primary Data
  1. Key data from primary sources
  2. Breakdown of primaries
3. Secondary And Primary Research
  1. Key industry insights
Market Size Estimation
1. Bottom-Up Approach
2. Top-Down Approach
3. Market Projection
Research Assumptions
1. Assumptions
Limitations
Risk Assessment