March 2026 Lam Research expanded its equipment-development strategy around faster process innovation and virtual manufacturing, supporting shorter development cycles for AI and advanced semiconductor devices.
November 2025 Lam Research expanded its Tualatin, Oregon, campus with a new engineering and laboratory building dedicated to semiconductor manufacturing equipment and process development.
September 2025 Lam Research and JSR Corporation’s Inpria entered a cross-licensing and collaboration agreement to advance dry-photoresist materials and equipment processes for next-generation semiconductor manufacturing.
September 2025 Lam Research launched the VECTOR TEOS 3D deposition system for advanced packaging, addressing dielectric-film requirements in 3D chip stacking and high-density heterogeneous integration.
June 2025 Applied Materials expanded its advanced packaging and semiconductor equipment development initiatives in the United States, strengthening capabilities for chiplet integration, hybrid bonding, and next-generation semiconductor manufacturing.