Semiconductor Assembly and Packaging Equipment Market Size, Share & Trends Analysis Report By Technology (Wire bonding, Die-attach, Flip-chip bumping and reflow, Wafer-level packaging, Hybrid / fine-pitch bonding, Underfill and dispense systems, Sintering / transient liquid phase bonding), By Equipment Type (Wire bonders, Die-attach machines / pick-and-place bonders, Hybrid / TCB bonders and aligners, Bump deposition & reflow systems, Wafer handling / FO WLP tooling and panel handling, Inspection & metrology, Test handlers, burn-in and sorting equipment), By End Use (IDMs, OSAT) and By Region (North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2026-2034