18 Nov, 2025
Straits Research published report, “Molded Interconnect Device (MID) Market Size & Outlook, 2026–2034”. According to the study, the market size valued at USD 2.91 billion in 2025 and is projected to expand to USD 8.2 billion by 2034, registering a compound annual growth rate (CAGR) of 12.9%.
The Molded Interconnect Device (MID) Market is supported by increasing adoption of compact and multifunctional electronic components in automotive, consumer electronics, and healthcare applications, along with the rising need for lightweight and space-efficient designs. Growing demand for connected devices and IoT-enabled systems, together with the integration of sensors, antennas, and switches into single molded components, drives the growth in both manufacturing process and product type segments.
With the growing government incentives for advanced manufacturing, R&D initiatives in areas of electronics and smart devices across the U.S., Germany, Japan, and South Korea, MID manufacturers as well as end-use industry players are increasingly finding new avenues for investment in flexible and high-density interconnect solutions.