Advanced Packaging Encapsulation Market Size, Share & Trends Analysis Report By Encapsulation Type (Compression Molding Compounds, Liquid Encapsulants, Transfer Molding Compounds, Glob Top Encapsulants), By Material Type (Epoxy-based Encapsulation Materials, Silicone-based Encapsulation Materials, Polyimide-based Encapsulation Materials, Hybrid Encapsulation Materials), By Application (Flip-Chip Packaging, 5D/3D IC Packaging, Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP)), By End User (Outsourced Semiconductor Assembly and Test (OSAT) Providers, Integrated Device Manufacturers (IDMs), Semiconductor Foundries, Fabless Semiconductor Companies) and By Region (North America, Europe, APAC, Middle East and Africa, LATAM) Forecasts, 2026-2034