Glass Reinforced Substrate Market Size, Share & Growth Report by 2034

Table Of Content

Executive Summary

Research Scope & Segmentation

Research Objectives
Limitations & Assumptions
Market Scope & Segmentation
Currency & Pricing Considered

Market Opportunity Assessment

Emerging Regions / Countries
Emerging Companies
Emerging Applications / End Use

Market Trends

Drivers
Market Warning Factors
Latest Macro Economic Indicators
Geopolitical Impact
Technology Factors

Market Assessment

Porters Five Forces Analysis
Value Chain Analysis

Regulatory Framework

North America
Europe
APAC
Middle East and Africa
LATAM

ESG Trends

Global Glass Reinforced Substrate Market Size Analysis

Global Glass Reinforced Substrate Market Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value

North America Market Analysis

Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value
U.S.
1. By Product
  1. Introduction
    1. Product By Value
  2. Glass-Reinforced Epoxy Laminates
    1. By Value
  3. Glass-Reinforced BT Resin
    1. By Value
  4. Glass-Reinforced Polyimide
    1. By Value
  5. Glass-Reinforced Cyanate Ester
    1. By Value
  6. Glass-Reinforced PTFE
    1. By Value
2. By Application
  1. Introduction
    1. Application By Value
  2. Printed Circuit Boards (PCBs)
    1. By Value
  3. IC Packaging Substrates
    1. By Value
  4. RF & Microwave Components
    1. By Value
  5. Automotive Electronic Modules
    1. By Value
  6. Display Panels
    1. By Value
  7. Others
    1. By Value
3. By Thickness
  1. Introduction
    1. Thickness By Value
  2. ≤ 0.1 mm
    1. By Value
  3. 1 mm – 0.5 mm
    1. By Value
  4. 5 mm – 1 mm
    1. By Value
  5. Above 1 mm
    1. By Value
4. By End-Use Industry
  1. Introduction
    1. End-Use Industry By Value
  2. Consumer Electronics
    1. By Value
  3. Telecommunications
    1. By Value
  4. Aerospace & Defense
    1. By Value
  5. Others
    1. By Value
Canada

Europe Market Analysis

Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value
U.K.
1. By Product
  1. Introduction
    1. Product By Value
  2. Glass-Reinforced Epoxy Laminates
    1. By Value
  3. Glass-Reinforced BT Resin
    1. By Value
  4. Glass-Reinforced Polyimide
    1. By Value
  5. Glass-Reinforced Cyanate Ester
    1. By Value
  6. Glass-Reinforced PTFE
    1. By Value
2. By Application
  1. Introduction
    1. Application By Value
  2. Printed Circuit Boards (PCBs)
    1. By Value
  3. IC Packaging Substrates
    1. By Value
  4. RF & Microwave Components
    1. By Value
  5. Automotive Electronic Modules
    1. By Value
  6. Display Panels
    1. By Value
  7. Others
    1. By Value
3. By Thickness
  1. Introduction
    1. Thickness By Value
  2. ≤ 0.1 mm
    1. By Value
  3. 1 mm – 0.5 mm
    1. By Value
  4. 5 mm – 1 mm
    1. By Value
  5. Above 1 mm
    1. By Value
4. By End-Use Industry
  1. Introduction
    1. End-Use Industry By Value
  2. Consumer Electronics
    1. By Value
  3. Telecommunications
    1. By Value
  4. Aerospace & Defense
    1. By Value
  5. Others
    1. By Value
Germany
France
Spain
Italy
Russia
Nordic
Benelux
Rest of Europe

APAC Market Analysis

Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value
China
1. By Product
  1. Introduction
    1. Product By Value
  2. Glass-Reinforced Epoxy Laminates
    1. By Value
  3. Glass-Reinforced BT Resin
    1. By Value
  4. Glass-Reinforced Polyimide
    1. By Value
  5. Glass-Reinforced Cyanate Ester
    1. By Value
  6. Glass-Reinforced PTFE
    1. By Value
2. By Application
  1. Introduction
    1. Application By Value
  2. Printed Circuit Boards (PCBs)
    1. By Value
  3. IC Packaging Substrates
    1. By Value
  4. RF & Microwave Components
    1. By Value
  5. Automotive Electronic Modules
    1. By Value
  6. Display Panels
    1. By Value
  7. Others
    1. By Value
3. By Thickness
  1. Introduction
    1. Thickness By Value
  2. ≤ 0.1 mm
    1. By Value
  3. 1 mm – 0.5 mm
    1. By Value
  4. 5 mm – 1 mm
    1. By Value
  5. Above 1 mm
    1. By Value
4. By End-Use Industry
  1. Introduction
    1. End-Use Industry By Value
  2. Consumer Electronics
    1. By Value
  3. Telecommunications
    1. By Value
  4. Aerospace & Defense
    1. By Value
  5. Others
    1. By Value
Korea
Japan
India
Australia
Taiwan
South East Asia
Rest of Asia-Pacific

Middle East and Africa Market Analysis

Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value
UAE
1. By Product
  1. Introduction
    1. Product By Value
  2. Glass-Reinforced Epoxy Laminates
    1. By Value
  3. Glass-Reinforced BT Resin
    1. By Value
  4. Glass-Reinforced Polyimide
    1. By Value
  5. Glass-Reinforced Cyanate Ester
    1. By Value
  6. Glass-Reinforced PTFE
    1. By Value
2. By Application
  1. Introduction
    1. Application By Value
  2. Printed Circuit Boards (PCBs)
    1. By Value
  3. IC Packaging Substrates
    1. By Value
  4. RF & Microwave Components
    1. By Value
  5. Automotive Electronic Modules
    1. By Value
  6. Display Panels
    1. By Value
  7. Others
    1. By Value
3. By Thickness
  1. Introduction
    1. Thickness By Value
  2. ≤ 0.1 mm
    1. By Value
  3. 1 mm – 0.5 mm
    1. By Value
  4. 5 mm – 1 mm
    1. By Value
  5. Above 1 mm
    1. By Value
4. By End-Use Industry
  1. Introduction
    1. End-Use Industry By Value
  2. Consumer Electronics
    1. By Value
  3. Telecommunications
    1. By Value
  4. Aerospace & Defense
    1. By Value
  5. Others
    1. By Value
Turkey
Saudi Arabia
South Africa
Egypt
Nigeria
Rest of MEA

LATAM Market Analysis

Introduction
By Product
1. Introduction
  1. Product By Value
2. Glass-Reinforced Epoxy Laminates
  1. By Value
3. Glass-Reinforced BT Resin
  1. By Value
4. Glass-Reinforced Polyimide
  1. By Value
5. Glass-Reinforced Cyanate Ester
  1. By Value
6. Glass-Reinforced PTFE
  1. By Value
By Application
1. Introduction
  1. Application By Value
2. Printed Circuit Boards (PCBs)
  1. By Value
3. IC Packaging Substrates
  1. By Value
4. RF & Microwave Components
  1. By Value
5. Automotive Electronic Modules
  1. By Value
6. Display Panels
  1. By Value
7. Others
  1. By Value
By Thickness
1. Introduction
  1. Thickness By Value
2. ≤ 0.1 mm
  1. By Value
3. 1 mm – 0.5 mm
  1. By Value
4. 5 mm – 1 mm
  1. By Value
5. Above 1 mm
  1. By Value
By End-Use Industry
1. Introduction
  1. End-Use Industry By Value
2. Consumer Electronics
  1. By Value
3. Telecommunications
  1. By Value
4. Aerospace & Defense
  1. By Value
5. Others
  1. By Value
Brazil
1. By Product
  1. Introduction
    1. Product By Value
  2. Glass-Reinforced Epoxy Laminates
    1. By Value
  3. Glass-Reinforced BT Resin
    1. By Value
  4. Glass-Reinforced Polyimide
    1. By Value
  5. Glass-Reinforced Cyanate Ester
    1. By Value
  6. Glass-Reinforced PTFE
    1. By Value
2. By Application
  1. Introduction
    1. Application By Value
  2. Printed Circuit Boards (PCBs)
    1. By Value
  3. IC Packaging Substrates
    1. By Value
  4. RF & Microwave Components
    1. By Value
  5. Automotive Electronic Modules
    1. By Value
  6. Display Panels
    1. By Value
  7. Others
    1. By Value
3. By Thickness
  1. Introduction
    1. Thickness By Value
  2. ≤ 0.1 mm
    1. By Value
  3. 1 mm – 0.5 mm
    1. By Value
  4. 5 mm – 1 mm
    1. By Value
  5. Above 1 mm
    1. By Value
4. By End-Use Industry
  1. Introduction
    1. End-Use Industry By Value
  2. Consumer Electronics
    1. By Value
  3. Telecommunications
    1. By Value
  4. Aerospace & Defense
    1. By Value
  5. Others
    1. By Value
Mexico
Argentina
Chile
Colombia
Rest of LATAM

Competitive Landscape

Glass Reinforced Substrate Market Share By Players
M&A Agreements & Collaboration Analysis

Market Players Assessment

Corning Incorporated
1. Overview
2. Business Information
3. Revenue
4. ASP
5. SWOT Analysis
6. Recent Developments
Panasonic Corporation
Showa Denko Materials Co., Ltd.
Isola Group
Rogers Corporation
Nippon Electric Glass Co., Ltd.
AGC Inc.
SKC
Franklin Fibre-Lamitex Company
Hexcel Corporation
Mitsubishi Gas Chemical Company (MGC)
Atlas Fibre Company
Reliance Industries Ltd.
SCHOTT AG
Toray Industries, Inc.
Sumitomo Bakelite Co., Ltd.
Taiwan Union Technology Corporation (TUC)
Ventec International Group
Nelco Products Inc.
DuPont de Nemours, Inc.

Research Methodology

Research Data
1. Secondary Data
  1. Major secondary sources
  2. Key data from secondary sources
2. Primary Data
  1. Key data from primary sources
  2. Breakdown of primaries
3. Secondary And Primary Research
  1. Key industry insights
Market Size Estimation
1. Bottom-Up Approach
2. Top-Down Approach
3. Market Projection
Research Assumptions
1. Assumptions
Limitations
Risk Assessment